Evidence map›Paper›PMID 38575613›Full record

ArticleNature communications2024

Low thermal contact resistance boron nitride nanosheets composites enabled by interfacial arc-like phonon bridge.

Ke Zhan, Yucong Chen, Zhiyuan Xiong, Yulun Zhang, Siyuan Ding, Fangzheng Zhen, Zhenshi Liu, Qiang Wei, Minsu Liu, Bo Sun and 2 more

Abstract read
In one paragraph

Article in Nature communications, 2024. The graph could read no effect estimate from its abstract, so it casts no vote on the map. Cited by 12 papers.

0numbers the graph read from it
0cells of the map it votes in
12citing papers in PubMed
–field-weighted citation impact
1 · What the graph read from it

What it found

Each row is one number read from the abstract, on the scale the paper reported it, with its interval. Left of the dashed line favours the treatment, right favours the comparator. Under each row is the sentence it came from. New to these charts? A ten-minute tutorial.

The abstract states no effect estimate the extractor could read, or names no intervention and outcome on the map, so this paper lights no cell and moves no belief. It is still indexed, cited and linked below.

2 · The registry

The trial behind it

Trials whose registry record cites this paper, or whose number appears in the abstract. A trial that started after this paper was published is citing it as background, not reporting it.

Neither the registry nor the abstract names a trial number. If this is a trial report, that itself is worth knowing.

3 · Its place in the literature

Who cites it

12 citing papers in PubMed.

  1. Article
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  10. Controlled Growth of Graphene-Skinned AlAdvanced science (Weinheim, Baden-Wurttemberg, Germany) · 2025
    Article
  11. Article
  12. Article
4 · The record

Corrections and comments

PubMed lists nothing against this paper. Absence here is not a guarantee, only a check that was made.

5 · Who and what money

Authors and funding

12 authors.

Ke Zhan *Shenzhen Geim Graphene Center (SGC), Tsinghua-Berkeley Shenzhen Institute (TBSI) & Tsinghua Shenzhen International Graduate School (TSIGS), Tsinghua University, 518055, Shenzhen, China.
Yucong Chen *Shenzhen Geim Graphene Center (SGC), Tsinghua-Berkeley Shenzhen Institute (TBSI) & Tsinghua Shenzhen International Graduate School (TSIGS), Tsinghua University, 518055, Shenzhen, China.ORCID http://orcid.org/0009-0005-4787-6784
Zhiyuan XiongSchool of Light Industry and Engineering, South China University of Technology, 510614, Guangzhou, China. xzyscut@scut.edu.cn.ORCID http://orcid.org/0009-0006-1750-5402
Yulun ZhangShenzhen Geim Graphene Center (SGC), Tsinghua-Berkeley Shenzhen Institute (TBSI) & Tsinghua Shenzhen International Graduate School (TSIGS), Tsinghua University, 518055, Shenzhen, China.
Siyuan DingShenzhen Geim Graphene Center (SGC), Tsinghua-Berkeley Shenzhen Institute (TBSI) & Tsinghua Shenzhen International Graduate School (TSIGS), Tsinghua University, 518055, Shenzhen, China.
Fangzheng ZhenMonash Suzhou Research Institute (MSRI), Monash University, 215000, Suzhou, China.
Zhenshi LiuSunwoda Electronic Co., Ltd., 518108, Shenzhen, China.
Qiang WeiVivo Mobile Communication Co., Ltd., 523860, Dongguan, China.
Minsu LiuShenzhen Geim Graphene Center (SGC), Tsinghua-Berkeley Shenzhen Institute (TBSI) & Tsinghua Shenzhen International Graduate School (TSIGS), Tsinghua University, 518055, Shenzhen, China.
Bo SunShenzhen Geim Graphene Center (SGC), Tsinghua-Berkeley Shenzhen Institute (TBSI) & Tsinghua Shenzhen International Graduate School (TSIGS), Tsinghua University, 518055, Shenzhen, China.ORCID http://orcid.org/0000-0002-2122-6637
Hui-Ming ChengShenzhen Key Lab of Energy Materials for Carbon Neutrality, Shenzhen Institute of Advanced Technology, Chinese Academy of Sciences, 1068 Xueyuan Road, 518055, Shenzhen, China. cheng@imr.ac.cn.ORCID http://orcid.org/0000-0002-5387-4241
Ling QiuShenzhen Geim Graphene Center (SGC), Tsinghua-Berkeley Shenzhen Institute (TBSI) & Tsinghua Shenzhen International Graduate School (TSIGS), Tsinghua University, 518055, Shenzhen, China. ling.qiu@sz.tsinghua.edu.cn.ORCID http://orcid.org/0000-0001-7830-7326

Funding

Guangdong Innovative and Entrepreneurial Research Team Program 2017ZT07C341National Natural Science Foundation of China (National Science Foundation of China) T2293693
6 · The paper itself

Abstract

Two-dimensional materials with ultrahigh in-plane thermal conductivity are ideal for heat spreader applications but cause significant thermal contact resistance in complex interfaces, limiting their use as thermal interface materials. In this study, we present an interfacial phonon bridge strategy to reduce the thermal contact resistance of boron nitride nanosheets-based composites. By using a low-molecular-weight polymer, we are able to manipulate the alignment of boron nitride nanosheets through sequential stacking and cutting, ultimately achieving flexible thin films with a layer of arc-like structure superimposed on perpendicularly aligned ones. Our results suggest that arc-like structure can act as a phonon bridge to lower the contact resistance by 70% through reducing phonon back-reflection and enhancing phonon coupling efficiency at the boundary. The resulting composites exhibit ultralow thermal contact resistance of 0.059 in

Identifiers

PMID38575613
PMCPMC10994942

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Read under generation 80e0d062 · epoch 390. Bibliography from PubMed, PubMed Central and OpenAlex; grants from NIH RePORTER; trial links from ClinicalTrials.gov; estimates, votes and beliefs from the OpenQuestion graph.