ArticleMicromachines2024
A MEMS Electrochemical Angular Accelerometer with Silicon-Based Four-Electrode Structure.
Article in Micromachines, 2024. The graph could read no effect estimate from its abstract, so it casts no vote on the map. Cited by 2 papers.
What it found
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The abstract states no effect estimate the extractor could read, or names no intervention and outcome on the map, so this paper lights no cell and moves no belief. It is still indexed, cited and linked below.
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Who cites it
2 citing papers in PubMed, 3 citations in OpenAlex.
- Linearity Improvement of MEMS Electrochemical Vibration Sensors Based on Tapered-Hole Technology.Micromachines · 2026Article
- Electrochemical vibration sensor for low frequency detection: model, design and manufacture.Microsystems & nanoengineering · 2026Review
Corrections and comments
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Authors and funding
7 authors at 1 institution in 1 country.
Funding
Abstract
This paper presents a MEMS electrochemical angular accelerometer with a silicon-based four-electrode structure, which was made of thousands of interconnected microchannels for electrolyte flow, anodes uniformly coated on structure surfaces and cathodes located on the sidewalls of flow holes. From the perspective of device fabrication, in this study, the previously reported multi-piece assembly was simplified into single-piece integrative manufacturing, effectively addressing the problems of complex assembly and manual alignment. From the perspective of the sensitive structure, in this study, the silicon-based four-electrode structure featuring with complete insulation layers between anodes and cathodes can enable fast electrochemical reactions with improved sensitivities. Numerical simulations were conducted to optimize the geometrical parameters of the silicon-based four-electrode structure, where increases in fluid resistance and cathode area were found to expand working bandwidths and improve device sensitivity, respectively. Then, the silicon-based four-electrode structure was fabricated by conventional MEMS processes, mainly composed of wafer-level bonding and wafer-level etching. As to device characterization, the MEMS electrochemical angular accelerometer with the silicon-based four-electrode structure exhibited a maximum sensitivity of 1458 V/(rad/s
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Registered trials
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