ArticleHeliyon2024
Preparation and performance of alumina/epoxy-siloxane composites: A comparative study on thermal- and photo-curing process.
Article in Heliyon, 2024. The graph could read no effect estimate from its abstract, so it casts no vote on the map. Cited by 3 papers.
What it found
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The abstract states no effect estimate the extractor could read, or names no intervention and outcome on the map, so this paper lights no cell and moves no belief. It is still indexed, cited and linked below.
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Who cites it
3 citing papers in PubMed, 8 citations in OpenAlex.
- Epoxy Composites Reinforced with Sol-Gel Synthesized Alumina-Silica, Alumina, and Natural Silica Fillers: Comparative Mechanical Performance.Gels (Basel, Switzerland) · 2026Article
- Interactions and Curing Dynamics Between UV-Triggered Epoxy Acrylate Binder, Curing Agents and Photoinitiators.Polymers · 2025Article
- Effect of Vibration Pretreatment-Microwave Curing Process Parameters on the Mechanical Performance of Resin-Based Composites.Polymers · 2024Article
Corrections and comments
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Authors and funding
5 authors at 2 institutions in 1 country.
Funding
No grant is acknowledged in the PubMed record.
Abstract
Although epoxy-based composites that consist of inorganic fillers and matrixes are widely used in "conventional" electronic packaging applications due to their excellent insulation and robust properties, they limit their uses in "advanced electronic packaging" which requires enhanced thermal conductivity. However, conventional thermal curing methods for fabrication of epoxy-based composites do not fulfill sufficient thermal conductivity. Herein, we apply photo-induced curing strategy for fabricating alumina-incorporated epoxy-siloxane composites that consist of sol-gel derived siloxane matrix and bimodal sized alumina particles as a thermally conductive filler. We investigate how curing mechanism (thermal- or UV-curing) and varying the ratios of the alumina particles of two different sizes affect the various physical properties. It is found that photo-curing process makes greatly enhanced thermal conductivity, low thermal expansion, and high mechanical robustness compared to thermally-cured composites. As the results, we can achieve significantly enhanced thermal conductivity (>11 W/m K) with high thermal stability and mechanical robustness.
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Registered trials
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