CTAB-Modulated Electroplating of Copper Micropillar Arrays for Non-Enzymatic Glucose Sensing with Improved Sensitivity.

Micropillar array electrodes represent a promising avenue for enhancing detection sensitivity and response current. However, existing methods for depositing electrode materials on micropillar arrays often result in uneven distribution, with the thin sidewall layer being less conductive and prone to corrosion. In addressing this issue, this study introduces electroplating to enhance the copper layer on the sidewall of micropillar array electrodes. These electrodes, fabricated through standard microelectronics processes and electroplating, are proposed for non-enzymatic glucose detection, with the copper layer deposited via electroplating significantly enhancing sensitivity. Initially, the impact of cetyltrimethylammonium bromide (CTAB) concentration as an inhibitor on the surface morphology and sensitivity of the plated layer was investigated. It was discovered that CTAB could decrease surface roughness, hinder the development of large and coarse grains, generate small particles, and boost sensitivity. Compared to the uncoated electrode and plating without CTAB, sensitivity was elevated by a factor of 1.66 and 1.62, respectively. Subsequently, the alterations in plating morphology and detection performance within a range of 0.3 ASD to 3 ASD were examined. Sensitivity demonstrated a tendency to increase initially and then decrease. The electrode plated at 0.75 ASD achieved a maximum sensitivity of 3314 μA·mM