Evidence map›Paper›PMID 38399922›Full record

ArticlePolymers2024

Flame-Retardant GF-PSB/DOPO-POSS Composite with Low Dk/Df and High Thermal Stability for High-Frequency Copper Clad Applications.

Ke Zheng, Yizhi Zhang, Jiaxiang Qiu, Guanqun Xie, Zengbiao Huang, Wei Lin, Zhimeng Liu, Qianfa Liu, Xiaoxia Wang

Open access · goldAbstract read
PubMed Full text at PMC Publisher
In one paragraph

Article in Polymers, 2024. The graph could read no effect estimate from its abstract, so it casts no vote on the map. Not yet cited in PubMed.

0numbers the graph read from it
0cells of the map it votes in
0citing papers in PubMed
0.7field-weighted citation impact, top 40% of its field
1 · What the graph read from it

What it found

Each row is one number read from the abstract, on the scale the paper reported it, with its interval. Left of the dashed line favours the treatment, right favours the comparator. Under each row is the sentence it came from. New to these charts? A ten-minute tutorial.

The abstract states no effect estimate the extractor could read, or names no intervention and outcome on the map, so this paper lights no cell and moves no belief. It is still indexed, cited and linked below.

2 · The registry

The trial behind it

Trials whose registry record cites this paper, or whose number appears in the abstract. A trial that started after this paper was published is citing it as background, not reporting it.

Neither the registry nor the abstract names a trial number. If this is a trial report, that itself is worth knowing.

3 · Its place in the literature

Who cites it

0 citing papers in PubMed, 4 citations in OpenAlex.

No citing paper in PubMed yet.

4 · The record

Corrections and comments

PubMed lists nothing against this paper. Absence here is not a guarantee, only a check that was made.

5 · Who and what money

Authors and funding

9 authors at 1 institution in 1 country.

Ke ZhengSub Center of Dongguan University of Technology of National Engineering Research Center of Electronic Circuits Base Materials, School of Materials Science and Engineering, Dongguan University of Technology, Dongguan 523808, China.
Yizhi ZhangSub Center of Dongguan University of Technology of National Engineering Research Center of Electronic Circuits Base Materials, School of Materials Science and Engineering, Dongguan University of Technology, Dongguan 523808, China.
Jiaxiang QiuSchool of Environment and Civil Engineering, Dongguan University of Technology, Dongguan 523808, China.
Guanqun XieSchool of Environment and Civil Engineering, Dongguan University of Technology, Dongguan 523808, China.
Zengbiao HuangNational Engineering Research Center of Electronic Circuits Base Materials, SHENGYI Technology Co., Ltd., Dongguan 523808, China.
Wei LinNational Engineering Research Center of Electronic Circuits Base Materials, SHENGYI Technology Co., Ltd., Dongguan 523808, China.
Zhimeng LiuSub Center of Dongguan University of Technology of National Engineering Research Center of Electronic Circuits Base Materials, School of Materials Science and Engineering, Dongguan University of Technology, Dongguan 523808, China.
Qianfa LiuNational Engineering Research Center of Electronic Circuits Base Materials, SHENGYI Technology Co., Ltd., Dongguan 523808, China.
Xiaoxia WangSub Center of Dongguan University of Technology of National Engineering Research Center of Electronic Circuits Base Materials, School of Materials Science and Engineering, Dongguan University of Technology, Dongguan 523808, China.ORCID 0000-0001-5094-0269
Dongguan University of Technology · CN

Funding

Dongguan Science and Technology Special Representative Project 20221800500532Graduate Education Innovation Program of Guangdong Province 221105029Guangdong Basic and Applied Basic Research Foundation 2020A1515110770National Natural Science Foundation of China 32301254
6 · The paper itself

Abstract

In the field of high-frequency communications devices, there is an urgent need to develop high-performance copper clad laminates (CCLs) with low dielectric loss (Df) plus good flame retardancy and thermal stability. The hydrocarbon resin styrene-butadiene block copolymer (PSB) was modified with the flame-retardant 9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide/polyhedral oligomeric silsesquioxanes (DOPO-POSS) to meet the demands of high-frequency and high-speed applications. The resulting DOPO-POSS-modified PSB was used as the resin matrix along with other additives to fabricate PSB/DOPO-POSS laminates. At a high-frequency of 10 GHz, the laminates containing 20 wt.% of DOPO-POSS and with a thickness of 0.09 mm exhibited a Df of 0.00328, which is much lower compared with the commercial PSB/PX-200 composite (Df: 0.00498) and the PSB without flame retardancy (Df: 0.00453). Afterwards, glass fiber cloth (GF) was used as a reinforcing material to manufacture GF-PSB/DOPO-POSS composite laminates with a thickness of 0.25 mm. The flame retardancy of GF-PSB/DOPO-POSS composite laminate reached vertical burning (UL-94) V-1 grade, and GF-PSB/DOPO-POSS exhibited higher thermal and dynamic mechanical properties than GF-PSB/PX-200. The results of a limited oxygen index (LOI) and self-extinguishing time tests also demonstrated the superior flame-retardant performance of DOPO-POSS compared with PX-200. The investigation indicates that GF-PSB/DOPO-POSS composite laminates have significant potential for use in fabricating a printed circuit board (PCB) for high-frequency and high-speed applications.

Indexed as

flame retardanthigh-frequency copper clad laminatelow dielectric losspolymer compositesthermal stability

Identifiers

PMID38399922
PMCPMC10892954
OpenAlexW4391981259

What OpenQuestion holds

Textmetadata
LicenceCC BY
Read underepoch 390

Registered trials

None linked

Read under generation 80e0d062 · epoch 390. Bibliography from PubMed, PubMed Central and OpenAlex; grants from NIH RePORTER; trial links from ClinicalTrials.gov; estimates, votes and beliefs from the OpenQuestion graph.