ReviewHeliyon2024
Fillers and methods to improve the effective (out-plane) thermal conductivity of polymeric thermal interface materials - A review.
Review in Heliyon, 2024. The graph could read no effect estimate from its abstract, so it casts no vote on the map. Cited by 9 papers.
What it found
Each row is one number read from the abstract, on the scale the paper reported it, with its interval. Left of the dashed line favours the treatment, right favours the comparator. Under each row is the sentence it came from. New to these charts? A ten-minute tutorial.
The abstract states no effect estimate the extractor could read, or names no intervention and outcome on the map, so this paper lights no cell and moves no belief. It is still indexed, cited and linked below.
The trial behind it
Trials whose registry record cites this paper, or whose number appears in the abstract. A trial that started after this paper was published is citing it as background, not reporting it.
Neither the registry nor the abstract names a trial number. If this is a trial report, that itself is worth knowing.
Who cites it
9 citing papers in PubMed.
- Mechanistic Structure-Property Relationships in Carbon/Polymer Composites: Connectivity, Junction Resistance, and Durability.Polymers · 2026Review
- Application of Sawdust-Derived Activated Carbon as a Bio-Based Filler in Vulcanized Rubber Bushings.Polymers · 2025Article
- Formulation Strategies for High-Thermal-Conductivity Organosilicon Potting Adhesive.Molecules (Basel, Switzerland) · 2025Article
- Preparation and Properties of Micron Near-Spherical Alumina Powders from Hydratable Alumina with Ammonium Fluoroborate.Materials (Basel, Switzerland) · 2025Article
- Synthesis and characterization of carbon based polymer composites reinforced with MWCNTs and graphite in PVDF matrix.Scientific reports · 2025Article
- Titanate-Coupled Aluminum as an Interfacial Modifier for Enhanced Thermal and Mechanical Performance in Hybrid Epoxy Composites.Polymers · 2025Article
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Corrections and comments
PubMed lists nothing against this paper. Absence here is not a guarantee, only a check that was made.
Authors and funding
7 authors.
Funding
No grant is acknowledged in the PubMed record.
Abstract
The internet of things and growing demand for smaller and more advanced devices has created the problem of high heat production in electronic equipment, which greatly reduces the work performance and life of the electronic instruments. Thermal interface material (TIM) is placed in between heat generating micro-chip and the heat dissipater to conduct all the produced heat to the heat sink. The development of suitable TIM with excellent thermal conductivity (TC) in both in-plane and through-plane directions is a very important need at present. For efficient thermal management, polymer composites are potential candidates. But in general, their thermal conductivity is low compared to that of metals. The filler integration into the polymer matrix is one of the two approaches used to increase the thermal conductivity of polymer composites and is also easy to scale up for industrial production. Another way to achieve this is to change the structure of polymer chains, which fall out of the scope of this work. In this review, considering the first approach, the authors have summarized recent developments in many types of fillers with different scenarios by providing multiple cases with successful strategies to improve through-plane thermal conductivity (TPTC) (k
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What OpenQuestion holds
Registered trials
Read under generation 80e0d062 · epoch 390. Bibliography from PubMed, PubMed Central and OpenAlex; grants from NIH RePORTER; trial links from ClinicalTrials.gov; estimates, votes and beliefs from the OpenQuestion graph.