Evidence map›Paper›PMID 38321072›Full record

ArticleNature communications2024

Anti-friction gold-based stretchable electronics enabled by interfacial diffusion-induced cohesion.

Jie Cao, Xusheng Liu, Jie Qiu, Zhifei Yue, Yang Li, Qian Xu, Yan Chen, Jiewen Chen, Hongfei Cheng, Guozhong Xing and 4 more

Abstract read
In one paragraph

Article in Nature communications, 2024. The graph could read no effect estimate from its abstract, so it casts no vote on the map. Cited by 16 papers.

0numbers the graph read from it
0cells of the map it votes in
16citing papers in PubMed
–field-weighted citation impact
1 · What the graph read from it

What it found

Each row is one number read from the abstract, on the scale the paper reported it, with its interval. Left of the dashed line favours the treatment, right favours the comparator. Under each row is the sentence it came from. New to these charts? A ten-minute tutorial.

The abstract states no effect estimate the extractor could read, or names no intervention and outcome on the map, so this paper lights no cell and moves no belief. It is still indexed, cited and linked below.

2 · The registry

The trial behind it

Trials whose registry record cites this paper, or whose number appears in the abstract. A trial that started after this paper was published is citing it as background, not reporting it.

Neither the registry nor the abstract names a trial number. If this is a trial report, that itself is worth knowing.

3 · Its place in the literature

Who cites it

16 citing papers in PubMed.

  1. Review
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  14. Capacitive in-sensor tactile computing.Nature communications · 2025
    Article
  15. Article
  16. Recent Progress of Soft and Bioactive Materials in Flexible Bioelectronics.Cyborg and bionic systems (Washington, D.C.) · 2025
    Review
4 · The record

Corrections and comments

PubMed lists nothing against this paper. Absence here is not a guarantee, only a check that was made.

5 · Who and what money

Authors and funding

14 authors.

Jie CaoFrontier Institute of Chip and System, State Key Laboratory of Integrated Chips and Systems, Zhangjiang Fudan International Innovation Center, Fudan University, Shanghai, 200433, China.ORCID http://orcid.org/0000-0001-6911-7184
Xusheng LiuFrontier Institute of Chip and System, State Key Laboratory of Integrated Chips and Systems, Zhangjiang Fudan International Innovation Center, Fudan University, Shanghai, 200433, China.
Jie QiuFrontier Institute of Chip and System, State Key Laboratory of Integrated Chips and Systems, Zhangjiang Fudan International Innovation Center, Fudan University, Shanghai, 200433, China.ORCID http://orcid.org/0000-0003-0582-1767
Zhifei YueFrontier Institute of Chip and System, State Key Laboratory of Integrated Chips and Systems, Zhangjiang Fudan International Innovation Center, Fudan University, Shanghai, 200433, China.
Yang LiFrontier Institute of Chip and System, State Key Laboratory of Integrated Chips and Systems, Zhangjiang Fudan International Innovation Center, Fudan University, Shanghai, 200433, China.
Qian XuFrontier Institute of Chip and System, State Key Laboratory of Integrated Chips and Systems, Zhangjiang Fudan International Innovation Center, Fudan University, Shanghai, 200433, China.
Yan ChenFrontier Institute of Chip and System, State Key Laboratory of Integrated Chips and Systems, Zhangjiang Fudan International Innovation Center, Fudan University, Shanghai, 200433, China.
Jiewen ChenFrontier Institute of Chip and System, State Key Laboratory of Integrated Chips and Systems, Zhangjiang Fudan International Innovation Center, Fudan University, Shanghai, 200433, China.
Hongfei ChengSchool of Materials Science and Engineering, Tongji University, Shanghai, 201804, China.
Guozhong XingKey Laboratory of Microelectronic Devices & Integrated Technology, Institute of Microelectronics, University of the Chinese Academy of Sciences, Chinese Academy of Sciences, Beijing, 100029, China.ORCID http://orcid.org/0000-0002-0618-1960
Enming SongShanghai Frontiers Science Research Base of Intelligent Optoelectronics and Perception, Institute of Optoelectronics, State Key Laboratory of Integrated Chips and Systems, Fudan University, Shanghai, 200433, China.
Ming WangFrontier Institute of Chip and System, State Key Laboratory of Integrated Chips and Systems, Zhangjiang Fudan International Innovation Center, Fudan University, Shanghai, 200433, China. wang_ming@fudan.edu.cn.ORCID http://orcid.org/0000-0003-0976-9871
Qi LiuFrontier Institute of Chip and System, State Key Laboratory of Integrated Chips and Systems, Zhangjiang Fudan International Innovation Center, Fudan University, Shanghai, 200433, China. qi_liu@fudan.edu.cn.
Ming LiuFrontier Institute of Chip and System, State Key Laboratory of Integrated Chips and Systems, Zhangjiang Fudan International Innovation Center, Fudan University, Shanghai, 200433, China.

Funding

National Natural Science Foundation of China (National Science Foundation of China) 62074164National Natural Science Foundation of China (National Science Foundation of China) 62104042National Natural Science Foundation of China (National Science Foundation of China) 62204052National Natural Science Foundation of China (National Science Foundation of China) 62204057
6 · The paper itself

Abstract

Stretchable electronics that prevalently adopt chemically inert metals as sensing layers and interconnect wires have enabled high-fidelity signal acquisition for on-skin applications. However, the weak interfacial interaction between inert metals and elastomers limit the tolerance of the device to external friction interferences. Here, we report an interfacial diffusion-induced cohesion strategy that utilizes hydrophilic polyurethane to wet gold (Au) grains and render them wrapped by strong hydrogen bonding, resulting in a high interfacial binding strength of 1017.6 N/m. By further constructing a nanoscale rough configuration of the polyurethane (RPU), the binding strength of Au-RPU device increases to 1243.4 N/m, which is 100 and 4 times higher than that of conventional polydimethylsiloxane and styrene-ethylene-butylene-styrene-based devices, respectively. The stretchable Au-RPU device can remain good electrical conductivity after 1022 frictions at 130 kPa pressure, and reliably record high-fidelity electrophysiological signals. Furthermore, an anti-friction pressure sensor array is constructed based on Au-RPU interconnect wires, demonstrating a superior mechanical durability for concentrated large pressure acquisition. This chemical modification-free approach of interfacial strengthening for chemically inert metal-based stretchable electronics is promising for three-dimensional integration and on-chip interconnection.

Identifiers

PMID38321072
PMCPMC10847152

What OpenQuestion holds

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Registered trials

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Read under generation 80e0d062 · epoch 390. Bibliography from PubMed, PubMed Central and OpenAlex; grants from NIH RePORTER; trial links from ClinicalTrials.gov; estimates, votes and beliefs from the OpenQuestion graph.