ArticleNano letters2024
Thermopower in Underpotential Deposition-Based Molecular Junctions.
Article in Nano letters, 2024. The graph could read no effect estimate from its abstract, so it casts no vote on the map. Cited by 3 papers.
What it found
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The abstract states no effect estimate the extractor could read, or names no intervention and outcome on the map, so this paper lights no cell and moves no belief. It is still indexed, cited and linked below.
The trial behind it
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Who cites it
3 citing papers in PubMed, 12 citations in OpenAlex.
- Tuning of Thermopower in Molecular Junctions by Molecularly Controlled Sculpting of the Density of States in Their Leads.Nano letters · 2026Article
- Engineering Charge Transport by Tunneling in Supramolecular Assemblies through Precise Control of Metal-Ligand Interactions.Small (Weinheim an der Bergstrasse, Germany) · 2025Article
- Unusually High Thermopower in Molecular Junctions from Molecularly Induced Quantized States in Their Semimetal Leads.Nano letters · 2025Article
Corrections and comments
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Authors and funding
5 authors at 2 institutions in 2 countries.
Funding
Abstract
Underpotential deposition (UPD) is an intriguing means for tailoring the interfacial electronic structure of an adsorbate at a substrate. Here we investigate the impact of UPD on thermoelectricity occurring in molecular tunnel junctions based on alkyl self-assembled monolayers (SAMs). We observed noticeable enhancements in the Seebeck coefficient of alkanoic acid and alkanethiol monolayers, by up to 2- and 4-fold, respectively, upon replacement of a conventional Au electrode with an analogous bimetallic electrode, Cu UPD on Au. Quantum transport calculations indicated that the increased Seebeck coefficients are due to the UPD-induced changes in the shape or position of transmission resonances corresponding to gateway orbitals, which depend on the choice of the anchor group. Our work unveils UPD as a potent means for altering the shape of the tunneling energy barrier at the molecule-electrode contact of alkyl SAM-based junctions and hence enhancing thermoelectric performance.
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Registered trials
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