Evidence map›Paper›PMID 38214822›Full record

ArticleNano-micro letters2024

3D-Printed Carbon-Based Conformal Electromagnetic Interference Shielding Module for Integrated Electronics.

Shaohong Shi, Yuheng Jiang, Hao Ren, Siwen Deng, Jianping Sun, Fangchao Cheng, Jingjing Jing, Yinghong Chen

Abstract read
PubMed Full text at PMC Publisher
In one paragraph

Article in Nano-micro letters, 2024. The graph could read no effect estimate from its abstract, so it casts no vote on the map. Cited by 24 papers.

0numbers the graph read from it
0cells of the map it votes in
24citing papers in PubMed
–field-weighted citation impact
1 · What the graph read from it

What it found

Each row is one number read from the abstract, on the scale the paper reported it, with its interval. Left of the dashed line favours the treatment, right favours the comparator. Under each row is the sentence it came from. New to these charts? A ten-minute tutorial.

The abstract states no effect estimate the extractor could read, or names no intervention and outcome on the map, so this paper lights no cell and moves no belief. It is still indexed, cited and linked below.

2 · The registry

The trial behind it

Trials whose registry record cites this paper, or whose number appears in the abstract. A trial that started after this paper was published is citing it as background, not reporting it.

Neither the registry nor the abstract names a trial number. If this is a trial report, that itself is worth knowing.

3 · Its place in the literature

Who cites it

24 citing papers in PubMed.

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4 · The record

Corrections and comments

PubMed lists nothing against this paper. Absence here is not a guarantee, only a check that was made.

5 · Who and what money

Authors and funding

8 authors.

Shaohong ShiState Key Laboratory of Featured Metal Materials and Life-Cycle Safety for Composite Structures, School of Resources, Environment and Materials, Guangxi University, No. 100, Daxuedong Road, Nanning, 530004, People's Republic of China.
Yuheng JiangState Key Laboratory of Featured Metal Materials and Life-Cycle Safety for Composite Structures, School of Resources, Environment and Materials, Guangxi University, No. 100, Daxuedong Road, Nanning, 530004, People's Republic of China.
Hao RenState Key Laboratory of Featured Metal Materials and Life-Cycle Safety for Composite Structures, School of Resources, Environment and Materials, Guangxi University, No. 100, Daxuedong Road, Nanning, 530004, People's Republic of China.
Siwen DengState Key Laboratory of Featured Metal Materials and Life-Cycle Safety for Composite Structures, School of Resources, Environment and Materials, Guangxi University, No. 100, Daxuedong Road, Nanning, 530004, People's Republic of China.
Jianping SunState Key Laboratory of Featured Metal Materials and Life-Cycle Safety for Composite Structures, School of Resources, Environment and Materials, Guangxi University, No. 100, Daxuedong Road, Nanning, 530004, People's Republic of China.
Fangchao ChengState Key Laboratory of Featured Metal Materials and Life-Cycle Safety for Composite Structures, School of Resources, Environment and Materials, Guangxi University, No. 100, Daxuedong Road, Nanning, 530004, People's Republic of China. fangchaocheng@gxu.edu.cn.
Jingjing JingState Key Laboratory of Polymer Materials Engineering, Polymer Research Institute of Sichuan University, Sichuan University, No. 24 South Section 1, Yihuan Road, Chengdu, 610065, People's Republic of China.
Yinghong ChenState Key Laboratory of Polymer Materials Engineering, Polymer Research Institute of Sichuan University, Sichuan University, No. 24 South Section 1, Yihuan Road, Chengdu, 610065, People's Republic of China. johnchen@scu.edu.cn.

Funding

No grant is acknowledged in the PubMed record.

6 · The paper itself

Abstract

Electromagnetic interference shielding (EMI SE) modules are the core component of modern electronics. However, the traditional metal-based SE modules always take up indispensable three-dimensional space inside electronics, posing a major obstacle to the integration of electronics. The innovation of integrating 3D-printed conformal shielding (c-SE) modules with packaging materials onto core electronics offers infinite possibilities to satisfy ideal SE function without occupying additional space. Herein, the 3D printable carbon-based inks with various proportions of graphene and carbon nanotube nanoparticles are well-formulated by manipulating their rheological peculiarity. Accordingly, the free-constructed architectures with arbitrarily-customized structure and multifunctionality are created via 3D printing. In particular, the SE performance of 3D-printed frame is up to 61.4 dB, simultaneously accompanied with an ultralight architecture of 0.076 g cm

Indexed as

3D printingCarbon-based nanoparticlesConformal electromagnetic interference shieldingIntegrated electronics

Identifiers

PMID38214822
PMCPMC10786807

What OpenQuestion holds

Textmetadata
LicenceCC BY
Read underepoch 390

Registered trials

None linked

Read under generation 80e0d062 · epoch 390. Bibliography from PubMed, PubMed Central and OpenAlex; grants from NIH RePORTER; trial links from ClinicalTrials.gov; estimates, votes and beliefs from the OpenQuestion graph.