ReviewSensors (Basel, Switzerland)2023
Application of Through Glass Via (TGV) Technology for Sensors Manufacturing and Packaging.
Review in Sensors (Basel, Switzerland), 2023. The graph could read no effect estimate from its abstract, so it casts no vote on the map. Cited by 10 papers.
What it found
Each row is one number read from the abstract, on the scale the paper reported it, with its interval. Left of the dashed line favours the treatment, right favours the comparator. Under each row is the sentence it came from. New to these charts? A ten-minute tutorial.
The abstract states no effect estimate the extractor could read, or names no intervention and outcome on the map, so this paper lights no cell and moves no belief. It is still indexed, cited and linked below.
The trial behind it
Trials whose registry record cites this paper, or whose number appears in the abstract. A trial that started after this paper was published is citing it as background, not reporting it.
Neither the registry nor the abstract names a trial number. If this is a trial report, that itself is worth knowing.
Who cites it
10 citing papers in PubMed.
- Effect of Surface Tension of Cleaning Solutions on the Cleanability of Through-Glass via (TGV) Substrates.Micromachines · 2026Article
- Microscopic Mechanism of Glass Surface Activation, Annealing and Etching on Glass-Ti/Cu Interfacial Adhesion.Micromachines · 2026Article
- A Review of Non-Laser and Laser Machining for Through-Glass via Fabrication.Micromachines · 2026Review
- Process Integration and Reliability Challenges of Through-Glass Vias for Glass-Based Advanced Packaging: A Focused Review.Micromachines · 2026Review
- Packaging Glasses: From Containers to EncapsulationMaterials (Basel, Switzerland) · 2026Review
- High-frequency characteristics analysis and optimization of coaxial-like TGVs.Scientific reports · 2026Article
- Low-Temperature Glass 3D Printing via Two-Photon and Single-Photon Polymerization of Oligo-Silsesquioxanes.Polymers · 2025Article
- Substrate Integrated Waveguide on Glass with Vacuum-Filled Tin Through Glass Vias for Millimeter-Wave Applications.Micromachines · 2024Article
- Progress in Research on Co-Packaged Optics.Micromachines · 2024Review
- Enhanced Epoxy Composites Reinforced by 3D-Aligned Aluminum Borate Nanowhiskers.Materials (Basel, Switzerland) · 2024Article
Corrections and comments
PubMed lists nothing against this paper. Absence here is not a guarantee, only a check that was made.
Authors and funding
7 authors.
Funding
Abstract
Glass has emerged as a highly versatile substrate for various sensor and MEMS packaging applications, including electromechanical, thermal, optical, biomedical, and RF devices, due to its exceptional properties such as high geometrical tolerances, outstanding heat and chemical resistance, excellent high-frequency electrical properties, and the ability to be hermetically sealed. In these applications, Through Glass Via (TGV) technology plays a vital role in manufacturing and packaging by creating electrical interconnections through glass substrates. This paper provides a comprehensive summary of the research progress in TGV fabrication along with its integrations, including through via formation and metallization. This paper also reviews the significant qualification and reliability achievements obtained by the scientific community for TGV technology. Additionally, this paper summarizes the application of TGV technology in various sensors such as MEMS sensors and discusses the potential applications and future development directions of TGV technology.
Indexed as
Identifiers
What OpenQuestion holds
Registered trials
Read under generation 80e0d062 · epoch 390. Bibliography from PubMed, PubMed Central and OpenAlex; grants from NIH RePORTER; trial links from ClinicalTrials.gov; estimates, votes and beliefs from the OpenQuestion graph.