Evidence map›Paper›PMID 38001116›Full record

ArticleNature communications2023

Tough soldering for stretchable electronics by small-molecule modulated interfacial assemblies.

Liqing Ai, Weikang Lin, Chunyan Cao, Pengyu Li, Xuejiao Wang, Dong Lv, Xin Li, Zhengbao Yang, Xi Yao

Open access · goldAbstract read
In one paragraph

Article in Nature communications, 2023. The graph could read no effect estimate from its abstract, so it casts no vote on the map. Cited by 19 papers.

0numbers the graph read from it
0cells of the map it votes in
19citing papers in PubMed
4.3field-weighted citation impact, top 5% of its field
1 · What the graph read from it

What it found

Each row is one number read from the abstract, on the scale the paper reported it, with its interval. Left of the dashed line favours the treatment, right favours the comparator. Under each row is the sentence it came from. New to these charts? A ten-minute tutorial.

The abstract states no effect estimate the extractor could read, or names no intervention and outcome on the map, so this paper lights no cell and moves no belief. It is still indexed, cited and linked below.

2 · The registry

The trial behind it

Trials whose registry record cites this paper, or whose number appears in the abstract. A trial that started after this paper was published is citing it as background, not reporting it.

Neither the registry nor the abstract names a trial number. If this is a trial report, that itself is worth knowing.

3 · Its place in the literature

Who cites it

19 citing papers in PubMed, 39 citations in OpenAlex.

  1. Article
  2. Review
  3. Review
  4. A Supramolecular Reversible and Anisotropic Conductive Adhesive for Flexible Electronics.Advanced science (Weinheim, Baden-Wurttemberg, Germany) · 2026
    Article
  5. Review
  6. Article
  7. Article
  8. Liquid Metals for Reconfigurable Bioelectronics.Advanced materials (Deerfield Beach, Fla.) · 2026
    Review
  9. Article
  10. Article
  11. Article
  12. Article
  13. Article
  14. Review
  15. Review
  16. Article
  17. Article
  18. Review
  19. Review
4 · The record

Corrections and comments

PubMed lists nothing against this paper. Absence here is not a guarantee, only a check that was made.

5 · Who and what money

Authors and funding

9 authors at 1 institution in 2 countries.

Liqing Ai *Department of Biomedical Sciences, City University of Hong Kong, Hong Kong, 999077, China.ORCID http://orcid.org/0000-0001-8063-9821
Weikang Lin *Department of Mechanical & Aerospace Engineering, Hong Kong University of Science and Technology, Hong Kong, 999077, China.
Chunyan Cao *Department of Biomedical Sciences, City University of Hong Kong, Hong Kong, 999077, China.
Pengyu LiDepartment of Mechanical & Aerospace Engineering, Hong Kong University of Science and Technology, Hong Kong, 999077, China.
Xuejiao WangDepartment of Biomedical Sciences, City University of Hong Kong, Hong Kong, 999077, China.ORCID http://orcid.org/0000-0001-5326-7524
Dong LvDepartment of Biomedical Sciences, City University of Hong Kong, Hong Kong, 999077, China.
Xin LiDepartment of Biomedical Sciences, City University of Hong Kong, Hong Kong, 999077, China.ORCID http://orcid.org/0000-0001-6843-4575
Zhengbao YangDepartment of Mechanical & Aerospace Engineering, Hong Kong University of Science and Technology, Hong Kong, 999077, China. zbyang@ust.hk.ORCID http://orcid.org/0000-0001-5075-0457
Xi YaoDepartment of Biomedical Sciences, City University of Hong Kong, Hong Kong, 999077, China. xi.yao@cityu.edu.hk.ORCID http://orcid.org/0000-0001-8986-3571
City University of Hong Kong · HK

Funding

No grant is acknowledged in the PubMed record.

6 · The paper itself

Abstract

The rapid-developing soft robots and wearable devices require flexible conductive materials to maintain electric functions over a large range of deformations. Considerable efforts are made to develop stretchable conductive materials; little attention is paid to the frequent failures of integrated circuits caused by the interface mismatch of soft substrates and rigid silicon-based microelectronics. Here, we present a stretchable solder with good weldability that can strongly bond with electronic components, benefiting from the hierarchical assemblies of liquid metal particles, small-molecule modulators, and non-covalently crosslinked polymer matrix. Our self-solder shows high conductivity (>2×10

Identifiers

PMID38001116
PMCPMC10673831
OpenAlexW4388966601

What OpenQuestion holds

Textmetadata
LicenceCC BY
Read underepoch 390

Registered trials

None linked

Read under generation 80e0d062 · epoch 390. Bibliography from PubMed, PubMed Central and OpenAlex; grants from NIH RePORTER; trial links from ClinicalTrials.gov; estimates, votes and beliefs from the OpenQuestion graph.