ArticleMicromachines2023
Failure Analysis for Gold Wire Bonding of Sensor Packaging Based on Experimental and Numerical Methods.
Yameng Sun et al.PubMed ↗Full text ↗Publisher ↗
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ArticleMicromachines2023
Yameng Sun et al.PubMed ↗Full text ↗Publisher ↗
No numbers read from the abstract.