ArticleMaterials (Basel, Switzerland)2023
Thermal Conductivity and Microstructure of Novel Flaxseed-Gum-Filled Epoxy Resin Biocomposite: Analytical Models and X-ray Computed Tomography.
Article in Materials (Basel, Switzerland), 2023. The graph could read no effect estimate from its abstract, so it casts no vote on the map. Cited by 1 paper.
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The abstract states no effect estimate the extractor could read, or names no intervention and outcome on the map, so this paper lights no cell and moves no belief. It is still indexed, cited and linked below.
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Who cites it
1 citing paper in PubMed, 2 citations in OpenAlex.
- Inverse-Vulcanized Sulfur-Soybean Oil Polymers as Renewable Materials with Tunable Thermal Insulation Properties: Effect of Formulation and Biochar Incorporation.International journal of molecular sciences · 2026Article
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Authors and funding
5 authors at 3 institutions in 1 country.
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Abstract
The growing awareness of the environment and sustainable development has prompted the search for solutions involving the development of bio-based composite materials for insulating applications, offering an alternative to traditional synthetic materials such as glass- and carbon-reinforced composites. In this study, we investigate the thermal and microstructural properties of new biocomposite insulating materials derived from flaxseed-gum-filled epoxy, with and without the inclusion of reinforced flax fibers. A theoretical approach is proposed to estimate the thermal conductivity, while the composite's microstructure is characterized using X-ray Computed Tomography and image analysis. The local thermal conductivity of the flax fibers and the flaxseed gum matrix is identified by using effective thermal conductivity measurements and analytical models. This study provides valuable insight into the thermal behavior of these biocomposites with varying compositions of flaxseed gum and epoxy resin. The results obtained could not only contribute to a better understanding the thermal properties of these materials but are also of significant interest for advanced numerical modeling applications.
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