ArticleACS omega2023
Curing Kinetics and Mechanical Properties of Epoxy-Cyanate Ester Composite Films for Microelectronic Applications.
Article in ACS omega, 2023. The graph could read no effect estimate from its abstract, so it casts no vote on the map. Cited by 1 paper.
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The abstract states no effect estimate the extractor could read, or names no intervention and outcome on the map, so this paper lights no cell and moves no belief. It is still indexed, cited and linked below.
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1 citing paper in PubMed.
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Authors and funding
4 authors.
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Abstract
In general, although abundant literature studies are available on epoxy resin systems, a complete description of the curing kinetics in epoxy-cyanate ester composites relevant to the microelectronics industry is still lacking. Herein, curing behaviors of Ajinomoto build-up films, which are epoxy/silica composites, were studied by the non-isothermal differential scanning calorimetry method, and then, three non-isothermal curing kinetics models and model-free curing methods were used to analyze curing behaviors. In addition, a copper layer was also deposited onto the surface of the build-up film, and its interfacial adhesion property was also analyzed at different pre-curing conditions. The results showed that the curing reaction of the build-up film contains two curing reaction processes, and the first curing process is suited for the autocatalytic curing model, while the other curing process is suited for the Kamal curing kinetics model. Three model-free curing methods were used to calculate the activating energy at different degrees of curing, which indicated that the activating energy is variable during the whole curing process. The interfacial adhesion strength between the build-up film and copper layer decreased with the increase in the degree of curing, which is attributed to the contribution of mechanical anchoring. This work will offer guidance in curing behaviors for improving interfacial bonding force and controlling warpage behavior for chip substrates in the future.
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