ArticleInnovation (Cambridge (Mass.))2023
Non-epitaxial growth of highly oriented transition metal dichalcogenides with density-controlled twin boundaries.
Article in Innovation (Cambridge (Mass.)), 2023. The graph could read no effect estimate from its abstract, so it casts no vote on the map. Cited by 3 papers.
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Who cites it
3 citing papers in PubMed.
- Multi-Scale Statistical Correlation between Morphological Anisotropy and Optical Response in Chemically Deposited AZO Nanorods.ACS omega · 2026Article
- Heterointerface-Driven Electronic Modulation in MoOSmall (Weinheim an der Bergstrasse, Germany) · 2025Article
- Unified transmission electron microscopy with the glovebox integrated system for investigating air-sensitive two-dimensional quantum materials.Innovation (Cambridge (Mass.)) · 2025Review
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Authors and funding
12 authors.
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Abstract
Twin boundaries (TBs) in transition metal dichalcogenides (TMDs) constitute distinctive one-dimensional electronic systems, exhibiting intriguing physical and chemical properties that have garnered significant attention in the fields of quantum physics and electrocatalysis. However, the controlled manipulation of TBs in terms of density and specific atomic configurations remains a formidable challenge. In this study, we present a non-epitaxial growth approach that enables the controlled and large-scale fabrication of homogeneous catalytically active TBs in monolayer TMDs on arbitrary substrates. Notably, the density achieved using this strategy is six times higher than that observed in convention chemical vapor deposition (CVD)-grown samples. Through rigorous experimental analysis and multigrain Wulff construction simulations, we elucidate the role of regulating the metal source diffusion process, which serves as the key factor for inducing the self-oriented growth of TMD grains and the formation of unified TBs. Furthermore, we demonstrate that this novel growth mode can be readily incorporated into the conventional CVD growth method by making a simple modification of the growth temperature profile, thereby offering a universal approach for engineering of grain boundaries in two-dimensional materials.
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Registered trials
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