Evidence map›Paper›PMID 37630889›Full record

ReviewNanomaterials (Basel, Switzerland)2023

A Review on Progress, Challenges, and Prospects of Material Jetting of Copper and Tungsten.

V Vinay K Doddapaneni, Kijoon Lee, Havva Eda Aysal, Brian K Paul, Somayeh Pasebani, Konstantinos A Sierros, Chinedum E Okwudire, Chih-Hung Chang

Abstract readReview
In one paragraph

Review in Nanomaterials (Basel, Switzerland), 2023. The graph could read no effect estimate from its abstract, so it casts no vote on the map. Cited by 8 papers.

0numbers the graph read from it
0cells of the map it votes in
8citing papers in PubMed
–field-weighted citation impact
1 · What the graph read from it

What it found

Each row is one number read from the abstract, on the scale the paper reported it, with its interval. Left of the dashed line favours the treatment, right favours the comparator. Under each row is the sentence it came from. New to these charts? A ten-minute tutorial.

The abstract states no effect estimate the extractor could read, or names no intervention and outcome on the map, so this paper lights no cell and moves no belief. It is still indexed, cited and linked below.

2 · The registry

The trial behind it

Trials whose registry record cites this paper, or whose number appears in the abstract. A trial that started after this paper was published is citing it as background, not reporting it.

Neither the registry nor the abstract names a trial number. If this is a trial report, that itself is worth knowing.

3 · Its place in the literature

Who cites it

8 citing papers in PubMed.

  1. Review
  2. Article
  3. Review
  4. Review
  5. Interpenetrating Composites: A Nomenclature Dilemma.Materials (Basel, Switzerland) · 2025
    Review
  6. Article
  7. Review
  8. Review
4 · The record

Corrections and comments

PubMed lists nothing against this paper. Absence here is not a guarantee, only a check that was made.

5 · Who and what money

Authors and funding

8 authors.

V Vinay K DoddapaneniSchool of Chemical, Biological and Environmental Engineering, Oregon State University, Corvallis, OR 97331, USA.ORCID 0000-0002-1221-3252
Kijoon LeeSchool of Mechanical, Industrial and Manufacturing Engineering, Oregon State University, Corvallis, OR 97331, USA.ORCID 0000-0002-4920-4296
Havva Eda AysalDepartment of Mechanical and Aerospace Engineering, West Virginia University, Morgantown, WV 26506, USA.ORCID 0000-0002-2112-7268
Brian K PaulSchool of Mechanical, Industrial and Manufacturing Engineering, Oregon State University, Corvallis, OR 97331, USA.
Somayeh PasebaniSchool of Mechanical, Industrial and Manufacturing Engineering, Oregon State University, Corvallis, OR 97331, USA.ORCID 0000-0001-8744-6598
Konstantinos A SierrosDepartment of Mechanical and Aerospace Engineering, West Virginia University, Morgantown, WV 26506, USA.
Chinedum E OkwudireDepartment of Mechanical Engineering, University of Michigan, Ann Arbor, MI 48109, USA.ORCID 0000-0001-6910-8827
Chih-Hung ChangSchool of Chemical, Biological and Environmental Engineering, Oregon State University, Corvallis, OR 97331, USA.ORCID 0000-0003-3429-3940

Funding

United States Department of Energy DE-EE0007888-10-4
6 · The paper itself

Abstract

Copper (Cu) and tungsten (W) possess exceptional electrical and thermal conductivity properties, making them suitable candidates for applications such as interconnects and thermal conductivity enhancements. Solution-based additive manufacturing (SBAM) offers unique advantages, including patterning capabilities, cost-effectiveness, and scalability among the various methods for manufacturing Cu and W-based films and structures. In particular, SBAM material jetting techniques, such as inkjet printing (IJP), direct ink writing (DIW), and aerosol jet printing (AJP), present a promising approach for design freedom, low material wastes, and versatility as either stand-alone printers or integrated with powder bed-based metal additive manufacturing (MAM). Thus, this review summarizes recent advancements in solution-processed Cu and W, focusing on IJP, DIW, and AJP techniques. The discussion encompasses general aspects, current status, challenges, and recent research highlights. Furthermore, this paper addresses integrating material jetting techniques with powder bed-based MAM to fabricate functional alloys and multi-material structures. Finally, the factors influencing large-scale fabrication and potential prospects in this area are explored.

Indexed as

additive manufacturingaerosol jet printingcopperdirect ink writingink formulationsinkjet printingscalabilitytungsten

Identifiers

PMID37630889
PMCPMC10459285

What OpenQuestion holds

Textmetadata
LicenceCC BY
Read underepoch 390

Registered trials

None linked

Read under generation 80e0d062 · epoch 390. Bibliography from PubMed, PubMed Central and OpenAlex; grants from NIH RePORTER; trial links from ClinicalTrials.gov; estimates, votes and beliefs from the OpenQuestion graph.