← Evidence map

ArticleAPL bioengineering2023

A low-profile electromechanical packaging system for soft-to-flexible bioelectronic interfaces.

Florian Fallegger et al.PubMed ↗Full text ↗Publisher ↗

No numbers read from the abstract.

9 papers cite it

2023
2024
2025
2026
this papercites it
Full record →Abstract, authors, funding and every citing paper · PMID 37600068