Evidence map›Paper›PMID 37421079›Full record

ArticleMicromachines2023

Inductively Coupled Plasma Dry Etching of Silicon Deep Trenches with Extremely Vertical Smooth Sidewalls Used in Micro-Optical Gyroscopes.

Yuyu Zhang, Yu Wu, Quanquan Sun, Lifeng Shen, Jie Lan, Lingxi Guo, Zhenfeng Shen, Xuefang Wang, Junfeng Xiao, Jianfeng Xu

Abstract read
PubMed Full text at PMC Publisher
In one paragraph

Article in Micromachines, 2023. The graph could read no effect estimate from its abstract, so it casts no vote on the map. Cited by 1 paper.

0numbers the graph read from it
0cells of the map it votes in
1citing papers in PubMed
–field-weighted citation impact
1 · What the graph read from it

What it found

Each row is one number read from the abstract, on the scale the paper reported it, with its interval. Left of the dashed line favours the treatment, right favours the comparator. Under each row is the sentence it came from. New to these charts? A ten-minute tutorial.

The abstract states no effect estimate the extractor could read, or names no intervention and outcome on the map, so this paper lights no cell and moves no belief. It is still indexed, cited and linked below.

2 · The registry

The trial behind it

Trials whose registry record cites this paper, or whose number appears in the abstract. A trial that started after this paper was published is citing it as background, not reporting it.

Neither the registry nor the abstract names a trial number. If this is a trial report, that itself is worth knowing.

3 · Its place in the literature

Who cites it

1 citing paper in PubMed.

  1. Article
4 · The record

Corrections and comments

PubMed lists nothing against this paper. Absence here is not a guarantee, only a check that was made.

5 · Who and what money

Authors and funding

10 authors.

Yuyu ZhangState Key Laboratory of Digital Manufacturing Equipment and Technology, School of Mechanical Science and Engineering, Huazhong University of Science and Technology, Wuhan 430074, China.
Yu WuState Key Laboratory of Digital Manufacturing Equipment and Technology, School of Mechanical Science and Engineering, Huazhong University of Science and Technology, Wuhan 430074, China.
Quanquan SunShanghai Aerospace Control Technology Institute, Shanghai 201109, China.ORCID 0000-0002-7361-2847
Lifeng ShenShanghai Aerospace Control Technology Institute, Shanghai 201109, China.
Jie LanShanghai Aerospace Control Technology Institute, Shanghai 201109, China.
Lingxi GuoShanghai Aerospace Control Technology Institute, Shanghai 201109, China.
Zhenfeng ShenShanghai Aerospace Control Technology Institute, Shanghai 201109, China.
Xuefang WangState Key Laboratory of Digital Manufacturing Equipment and Technology, School of Mechanical Science and Engineering, Huazhong University of Science and Technology, Wuhan 430074, China.
Junfeng XiaoState Key Laboratory of Digital Manufacturing Equipment and Technology, School of Mechanical Science and Engineering, Huazhong University of Science and Technology, Wuhan 430074, China.ORCID 0000-0002-8057-7429
Jianfeng XuState Key Laboratory of Digital Manufacturing Equipment and Technology, School of Mechanical Science and Engineering, Huazhong University of Science and Technology, Wuhan 430074, China.

Funding

No grant is acknowledged in the PubMed record.

6 · The paper itself

Abstract

Micro-optical gyroscopes (MOGs) place a range of components of the fiber-optic gyroscope (FOG) onto a silicon substrate, enabling miniaturization, low cost, and batch processing. MOGs require high-precision waveguide trenches fabricated on silicon instead of the ultra-long interference ring of conventional F OGs. In our study, the Bosch process, pseudo-Bosch process, and cryogenic etching process were investigated to fabricate silicon deep trenches with vertical and smooth sidewalls. Different process parameters and mask layer materials were explored for their effect on etching. The effect of charges in the Al mask layer was found to cause undercut below the mask, which can be suppressed by selecting proper mask materials such as SiO

Indexed as

Bosch processcryogenic etchingpseudo-Bosch processsilicon deep trenches

Identifiers

PMID37421079
PMCPMC10141639

What OpenQuestion holds

Textmetadata
LicenceCC BY
Read underepoch 390

Registered trials

None linked

Read under generation 80e0d062 · epoch 390. Bibliography from PubMed, PubMed Central and OpenAlex; grants from NIH RePORTER; trial links from ClinicalTrials.gov; estimates, votes and beliefs from the OpenQuestion graph.