Evidence map›Paper›PMID 37421007›Full record

ArticleMicromachines2023

Improving the Thickness Uniformity of Micro Gear by Multi-Step, Self-Aligned Lithography and Electroforming.

Huan Wang, Jing Xie, Tao Fan, Dapeng Sun, Chaobo Li

Abstract read
In one paragraph

Article in Micromachines, 2023. The graph could read no effect estimate from its abstract, so it casts no vote on the map. Cited by 5 papers.

0numbers the graph read from it
0cells of the map it votes in
5citing papers in PubMed
–field-weighted citation impact
1 · What the graph read from it

What it found

Each row is one number read from the abstract, on the scale the paper reported it, with its interval. Left of the dashed line favours the treatment, right favours the comparator. Under each row is the sentence it came from. New to these charts? A ten-minute tutorial.

The abstract states no effect estimate the extractor could read, or names no intervention and outcome on the map, so this paper lights no cell and moves no belief. It is still indexed, cited and linked below.

2 · The registry

The trial behind it

Trials whose registry record cites this paper, or whose number appears in the abstract. A trial that started after this paper was published is citing it as background, not reporting it.

Neither the registry nor the abstract names a trial number. If this is a trial report, that itself is worth knowing.

3 · Its place in the literature

Who cites it

5 citing papers in PubMed.

  1. Review
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4 · The record

Corrections and comments

PubMed lists nothing against this paper. Absence here is not a guarantee, only a check that was made.

5 · Who and what money

Authors and funding

5 authors.

Huan WangInstitute of Microelectronics of the Chinese Academy of Sciences, Beijing 100029, China.
Jing XieInstitute of Microelectronics of the Chinese Academy of Sciences, Beijing 100029, China.ORCID 0000-0002-8143-5051
Tao FanInstitute of Microelectronics of the Chinese Academy of Sciences, Beijing 100029, China.
Dapeng SunInstitute of Microelectronics of the Chinese Academy of Sciences, Beijing 100029, China.
Chaobo LiInstitute of Microelectronics of the Chinese Academy of Sciences, Beijing 100029, China.

Funding

the Key Research Program of Frontier Projects of the Chinese Academy of Sciences: Original Innovation Projects from 0 to 1;the National Natural Science Foundation of China ZDBS-LY-JSC010;12274435
6 · The paper itself

Abstract

The thickness nonuniformity of an electroformed layer is a bottleneck problem for electroformed micro metal devices. In this paper, a new fabrication method is proposed to improve the thickness uniformity of micro gear, which is the key element of various microdevices. The effect of the thickness of the photoresist on the uniformity was studied by simulation analysis, which showed that as the thickness of the photoresist increased, the thickness nonuniformity of the electroformed gear should decrease due to the reduced edge effect of the current density. Differently from the traditional method performed by one-step front lithography and electroforming, multi-step, self-aligned lithography and electroforming are used to fabricate micro gear structures in proposed method, which intermittently keeps the thickness of photoresist from decreasing during processes of alternate lithography and electroforming. The experimental results show that the thickness uniformity of micro gear fabricated by the proposed method was improved by 45.7% compared with that fabricated by the traditional method. Meanwhile, the roughness of the middle region of the gear structure was reduced by 17.4%.

Indexed as

micro-electroformingroughnessself-aligned lithographythickness uniformity

Identifiers

PMID37421007
PMCPMC10144376

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Read under generation 80e0d062 · epoch 390. Bibliography from PubMed, PubMed Central and OpenAlex; grants from NIH RePORTER; trial links from ClinicalTrials.gov; estimates, votes and beliefs from the OpenQuestion graph.