ArticleACS omega2023
Research on Properties of Silicone-Modified Epoxy Resin and 3D Printing Materials.
Article in ACS omega, 2023. The graph could read no effect estimate from its abstract, so it casts no vote on the map. Cited by 2 papers.
What it found
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The abstract states no effect estimate the extractor could read, or names no intervention and outcome on the map, so this paper lights no cell and moves no belief. It is still indexed, cited and linked below.
The trial behind it
Trials whose registry record cites this paper, or whose number appears in the abstract. A trial that started after this paper was published is citing it as background, not reporting it.
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Who cites it
2 citing papers in PubMed.
Corrections and comments
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Authors and funding
5 authors.
Funding
No grant is acknowledged in the PubMed record.
Abstract
A kind of organosilicon intermediate was prepared using isophorone diisocyanate (IPDI), hydroxyl silicone oil (HSO), and hydroxyethyl acrylate (HEA). The organosilicon modification of epoxy resin was realized by introducing a -Si-O- group into the side chain of epoxy resin by chemical grafting. The effects of organosilicon modification of epoxy resin on the mechanical properties systematically discuss its heat resistance and micromorphology. The results indicate that the curing shrinkage of the resin was decreased and the printing accuracy was improved. At the same time, the mechanical properties of the material are enhanced; the IS and elongation at break (EAB) are enhanced by 32.8 and 8.65%, respectively. The brittle fracture is changed to a ductile fracture, and the tensile strength (TS) of the material is decreased. The glass transition temperature (GTT) of the modified epoxy resin increased by 8.46 °C, and
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Registered trials
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