Evidence map›Paper›PMID 37374716›Full record

ReviewMicromachines2023

Interconnection Technologies for Flexible Electronics: Materials, Fabrications, and Applications.

Ratul Kumar Baruah, Hocheon Yoo, Eun Kwang Lee

Open access · goldAbstract readReview
In one paragraph

Review in Micromachines, 2023. The graph could read no effect estimate from its abstract, so it casts no vote on the map. Cited by 13 papers.

0numbers the graph read from it
0cells of the map it votes in
13citing papers in PubMed
5.2field-weighted citation impact, top 4% of its field
1 · What the graph read from it

What it found

Each row is one number read from the abstract, on the scale the paper reported it, with its interval. Left of the dashed line favours the treatment, right favours the comparator. Under each row is the sentence it came from. New to these charts? A ten-minute tutorial.

The abstract states no effect estimate the extractor could read, or names no intervention and outcome on the map, so this paper lights no cell and moves no belief. It is still indexed, cited and linked below.

2 · The registry

The trial behind it

Trials whose registry record cites this paper, or whose number appears in the abstract. A trial that started after this paper was published is citing it as background, not reporting it.

Neither the registry nor the abstract names a trial number. If this is a trial report, that itself is worth knowing.

3 · Its place in the literature

Who cites it

13 citing papers in PubMed, 47 citations in OpenAlex.

  1. Review
  2. Article
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  4. Stress-Engineered SS/LiCoOChemistry, an Asian journal · 2026
    Article
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4 · The record

Corrections and comments

PubMed lists nothing against this paper. Absence here is not a guarantee, only a check that was made.

5 · Who and what money

Authors and funding

3 authors at 3 institutions in 2 countries.

Ratul Kumar BaruahDepartment of Electronics and Communication Engineering, Tezpur University, Assam 784028, India.
Hocheon YooDepartment of Electronic Engineering, Gachon University, Seongnam 13120, Republic of Korea.ORCID 0000-0003-0772-3327
Eun Kwang LeeDepartment of Chemical Engineering, Pukyong National University, Busan 48513, Republic of Korea.ORCID 0000-0001-5727-5716
Gachon University · KRPukyong National University · KRTezpur University · IN

Funding

National Research Foundation of Korea This research was supported by a National Research Foundation of Korea (NRF) grant funded by the Korean Government (NRF-2022R1F1A1076383).
6 · The paper itself

Abstract

Flexible electronic devices require metal interconnects to facilitate the flow of electrical signals among the device components, ensuring its proper functionality. There are multiple factors to consider when designing metal interconnects for flexible electronics, including their conductivity, flexibility, reliability, and cost. This article provides an overview of recent endeavors to create flexible electronic devices through different metal interconnect approaches, with a focus on materials and structural aspects. Additionally, the article discusses emerging flexible applications, such as e-textiles and flexible batteries, as essential considerations.

Indexed as

flexible circuitsflexible devicesflexible metalflexible textilemetal routingplastic substrates

Identifiers

PMID37374716
PMCPMC10305052
OpenAlexW4378576092

What OpenQuestion holds

Textmetadata
LicenceCC BY
Read underepoch 390

Registered trials

None linked

Read under generation 80e0d062 · epoch 390. Bibliography from PubMed, PubMed Central and OpenAlex; grants from NIH RePORTER; trial links from ClinicalTrials.gov; estimates, votes and beliefs from the OpenQuestion graph.