ReviewAdvanced science (Weinheim, Baden-Wurttemberg, Germany)2023
Materials Quest for Advanced Interconnect Metallization in Integrated Circuits.
Review in Advanced science (Weinheim, Baden-Wurttemberg, Germany), 2023. The graph could read no effect estimate from its abstract, so it casts no vote on the map. Cited by 12 papers.
What it found
Each row is one number read from the abstract, on the scale the paper reported it, with its interval. Left of the dashed line favours the treatment, right favours the comparator. Under each row is the sentence it came from. New to these charts? A ten-minute tutorial.
The abstract states no effect estimate the extractor could read, or names no intervention and outcome on the map, so this paper lights no cell and moves no belief. It is still indexed, cited and linked below.
The trial behind it
Trials whose registry record cites this paper, or whose number appears in the abstract. A trial that started after this paper was published is citing it as background, not reporting it.
Neither the registry nor the abstract names a trial number. If this is a trial report, that itself is worth knowing.
Who cites it
12 citing papers in PubMed.
- Eco-Friendly Protection of Copper via Self-Assembled Monolayer Films: The Critical Effect of Pollen Source Region on Anti-Corrosion Behavior.ACS omega · 2026Article
- Coupled Roles of Surface Chemistry and Hydrogen-Assisted Cycling in Ruthenium Atomic Layer Deposition on Silicon Oxides.ACS omega · 2026Article
- Turing-patterned TaNature communications · 2026Article
- Accelerated Discovery of Topological Conductors for Nanoscale Interconnects.Advanced science (Weinheim, Baden-Wurttemberg, Germany) · 2026Article
- Small and Simple Molecular Structure Based Thermally Stable Ruthenium Precursor in Advancing Ruthenium ALD Process for Scaled Interconnect Metallization.Advanced science (Weinheim, Baden-Wurttemberg, Germany) · 2026Article
- Single atom Ru-supported reduced graphene oxide integrated self-assembled monolayer as a nm-scale Cu diffusion barrier.Nature communications · 2025Article
- Grain boundary motions of low temperature and low pressure copper to copper direct bonding by electroplating ultra-fine-grain (UFG) Cu.Scientific reports · 2025Article
- Advanced Atomic Layer Modulation Based Highly Homogeneous PtRu Precious Metals Alloy Thin Films.Advanced science (Weinheim, Baden-Wurttemberg, Germany) · 2025Article
- Single-Molecule Junctions Formed Using Different Electrode Metals Under an Inert Atmosphere.Small (Weinheim an der Bergstrasse, Germany) · 2025Article
- Investigation on Electromigration-Induced Failure and Reservoir Effect in AlCu Interconnects.Micromachines · 2025Article
- Unraveling Interdiffusion Phenomena and the Role of Nanoscale Diffusion Barriers in the Copper-Gold System.ACS nano · 2024Article
- Materials Quest for Advanced Interconnect Metallization in Integrated Circuits.Advanced science (Weinheim, Baden-Wurttemberg, Germany) · 2023Review
Corrections and comments
PubMed lists nothing against this paper. Absence here is not a guarantee, only a check that was made.
Authors and funding
8 authors.
Funding
Abstract
Integrated circuits (ICs) are challenged to deliver historically anticipated performance improvements while increasing the cost and complexity of the technology with each generation. Front-end-of-line (FEOL) processes have provided various solutions to this predicament, whereas the back-end-of-line (BEOL) processes have taken a step back. With continuous IC scaling, the speed of the entire chip has reached a point where its performance is determined by the performance of the interconnect that bridges billions of transistors and other devices. Consequently, the demand for advanced interconnect metallization rises again, and various aspects must be considered. This review explores the quest for new materials for successfully routing nanoscale interconnects. The challenges in the interconnect structures as physical dimensions shrink are first explored. Then, various problem-solving options are considered based on the properties of materials. New materials are also introduced for barriers, such as 2D materials, self-assembled molecular layers, high-entropy alloys, and conductors, such as Co and Ru, intermetallic compounds, and MAX phases. The comprehensive discussion of each material includes state-of-the-art studies ranging from the characteristics of materials by theoretical calculation to process applications to the current interconnect structures. This review intends to provide a materials-based implementation strategy to bridge the gap between academia and industry.
Indexed as
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What OpenQuestion holds
Registered trials
Read under generation 80e0d062 · epoch 390. Bibliography from PubMed, PubMed Central and OpenAlex; grants from NIH RePORTER; trial links from ClinicalTrials.gov; estimates, votes and beliefs from the OpenQuestion graph.