Evidence map›Paper›PMID 37242913›Full record

ArticlePolymers2023

Improvement in the Thermal Conductivity of Silver Epoxy Adhesive by Treating with Water Vapor.

Yiyang E, Zhaobo Tian, Keyu Chi, Renyao Jiang, You Lv, Qi Sun, Yuan Zhu

Abstract read
In one paragraph

Article in Polymers, 2023. The graph could read no effect estimate from its abstract, so it casts no vote on the map. Cited by 1 paper.

0numbers the graph read from it
0cells of the map it votes in
1citing papers in PubMed
–field-weighted citation impact
1 · What the graph read from it

What it found

Each row is one number read from the abstract, on the scale the paper reported it, with its interval. Left of the dashed line favours the treatment, right favours the comparator. Under each row is the sentence it came from. New to these charts? A ten-minute tutorial.

The abstract states no effect estimate the extractor could read, or names no intervention and outcome on the map, so this paper lights no cell and moves no belief. It is still indexed, cited and linked below.

2 · The registry

The trial behind it

Trials whose registry record cites this paper, or whose number appears in the abstract. A trial that started after this paper was published is citing it as background, not reporting it.

Neither the registry nor the abstract names a trial number. If this is a trial report, that itself is worth knowing.

3 · Its place in the literature

Who cites it

1 citing paper in PubMed.

  1. Article
4 · The record

Corrections and comments

PubMed lists nothing against this paper. Absence here is not a guarantee, only a check that was made.

5 · Who and what money

Authors and funding

7 authors.

Yiyang ESchool of Microelectronics, Southern University of Science and Technology, Shenzhen 518055, China.
Zhaobo TianSchool of Microelectronics, Southern University of Science and Technology, Shenzhen 518055, China.
Keyu ChiFoshan (Southern China) Institute for New Materials, Foshan 528000, China.
Renyao JiangSchool of Microelectronics, Southern University of Science and Technology, Shenzhen 518055, China.
You LvSchool of Microelectronics, Southern University of Science and Technology, Shenzhen 518055, China.
Qi SunFoshan (Southern China) Institute for New Materials, Foshan 528000, China.
Yuan ZhuSchool of Microelectronics, Southern University of Science and Technology, Shenzhen 518055, China.

Funding

National Natural Science Foundation of China 51872153National Natural Science Foundation of China 52122607National Natural Science Foundation of China 52202232National Natural Science Foundation of China 52272114National Natural Science Foundation of China U20A20241State Key Laboratory of New Ceramic and Fine Processing Tsinghua University KF202206The Technology Innovation Commission of Shenzhen JCYJ20210324104608024
6 · The paper itself

Abstract

With the miniaturization of electronic devices, electronic packaging has become increasingly precise and complex, which presents a significant challenge in terms of heat dissipation. Electrically conductive adhesives (ECAs), particularly silver epoxy adhesives, have emerged as a new type of electronic packaging material, thanks to their high conductivity and stable contact resistance. However, while there has been extensive research on silver epoxy adhesives, little attention has been paid to improving their thermal conductivity, which is a critical requirement in the ECA industry. In this paper, we propose a straightforward method for treating silver epoxy adhesive with water vapor, resulting in a remarkable improvement in thermal conductivity to 9.1 W/(m·K), three times higher than the sample cured using traditional methods (2.7 W/(m·K)). Through research and analysis, the study demonstrates that the introduction of H

Indexed as

electrical conductivitysilver epoxy adhesivesilver particlesthermal conductivityvapor

Identifiers

PMID37242913
PMCPMC10220636

What OpenQuestion holds

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LicenceCC BY
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Registered trials

None linked

Read under generation 80e0d062 · epoch 390. Bibliography from PubMed, PubMed Central and OpenAlex; grants from NIH RePORTER; trial links from ClinicalTrials.gov; estimates, votes and beliefs from the OpenQuestion graph.