ArticleAdvanced science (Weinheim, Baden-Wurttemberg, Germany)2023
Residual Strain Evolution Induced by Crystallization Kinetics During Anti-Solvent Spin Coating in Organic-Inorganic Hybrid Perovskite.
Article in Advanced science (Weinheim, Baden-Wurttemberg, Germany), 2023. The graph could read no effect estimate from its abstract, so it casts no vote on the map. Cited by 3 papers.
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3 citing papers in PubMed.
- Balancing Crystallization Kinetics and Lattice Strain Enables Thermally Stable Slot-Die-Coated Narrow-Bandgap Perovskite Solar Cells.Advanced science (Weinheim, Baden-Wurttemberg, Germany) · 2026Article
- Crystallization modulation for wide-bandgap perovskites with universal defect passivation toward efficient perovskite/organic tandem photovoltaics.Nature communications · 2026Article
- Residual Strain Evolution Induced by Crystallization Kinetics During Anti-Solvent Spin Coating in Organic-Inorganic Hybrid Perovskite.Advanced science (Weinheim, Baden-Wurttemberg, Germany) · 2023Article
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8 authors.
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Abstract
Organic-inorganic hybrid perovskite (OIHP) polycrystalline thin films are attractive due to their outstanding photoelectronic properties. The anti-solvent spin coating method is the most widely used to synthesize these thin films, and the residual strain is inevitably originates and evolves during the process. However, this residual strain evolution induced by crystallization kinetics is still poorly understood. In this work, the in situ and ex situ synchrotron grazing-incidence wide-angle X-ray scattering (GIWAXS) are utilized to characterize the evolution and distribution of the residual strain in the OIHP polycrystalline thin film during the anti-solvent spin coating process. A mechanical model is established and the mechanism of the crystallization kinetics-induced residual strain evolution process is discussed. This work reveals a comprehensive understanding of the residual strain evolution during the anti-solvent spin coating process in the OIHP polycrystalline thin films and provides important guidelines for the residual strain-related strain engineering, morphology control, and performance enhancement.
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