ArticleScientific reports2023
Self-assembling bilayer wiring with highly conductive liquid metal and insulative ion gel layers.
Article in Scientific reports, 2023. The graph could read no effect estimate from its abstract, so it casts no vote on the map. Cited by 1 paper.
What it found
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The abstract states no effect estimate the extractor could read, or names no intervention and outcome on the map, so this paper lights no cell and moves no belief. It is still indexed, cited and linked below.
The trial behind it
Trials whose registry record cites this paper, or whose number appears in the abstract. A trial that started after this paper was published is citing it as background, not reporting it.
Neither the registry nor the abstract names a trial number. If this is a trial report, that itself is worth knowing.
Who cites it
1 citing paper in PubMed.
- Flexible Porous Pomelo Pith Derived Janus Liquid Metal and Adhesive Hydrogel Hybrid Electronic Skins.Smart medicine · 2026Article
Corrections and comments
PubMed lists nothing against this paper. Absence here is not a guarantee, only a check that was made.
Authors and funding
10 authors.
Funding
Abstract
Ga-based liquid metals (LMs) are expected to be suitable for wiring highly deformable devices because of their high electrical conductivity and stable resistance to extreme deformation. Injection and printed wiring, and wiring using LM-polymer composites are the most popular LM wiring approaches. However, additional processing is required to package the wiring after LM patterning, branch and interrupt wiring shape, and ensure adequate conductivity, which results in unnecessary wiring shape changes and increased complexity of the wiring methods. In this study, we propose an LM-polymer composite comprising LM particles and ion gel as a flexible matrix material with low viscosity and specific gravity before curing. Moreover, the casting method is used for wire patterning, and the material is cured at room temperature to ensure that the upper insulative layer of the ion gel self-assembles simultaneously with the formation of LM wiring in the lower layer. High conductivity and low resistance change rate of the formed wiring during deformation are achieved without an activation process. This ion gel-LM bilayer wiring can be used for three-dimensional wiring by stacking. Furthermore, circuits fabricated using ion gel-LM bilayer wiring exhibit stable operation. Therefore, the proposed method can significantly promote the development of flexible electronic devices.
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Registered trials
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