Evidence map›Paper›PMID 36939942›Full record

ArticleFrontiers of optoelectronics2023

Co-packaged optics (CPO): status, challenges, and solutions.

Min Tan, Jiang Xu, Siyang Liu, Junbo Feng, Hua Zhang, Chaonan Yao, Shixi Chen, Hangyu Guo, Gengshi Han, Zhanhao Wen and 23 more

Full text read
In one paragraph

Article in Frontiers of optoelectronics, 2023. The graph could read no effect estimate from its abstract, so it casts no vote on the map. Cited by 16 papers.

0numbers the graph read from it
0cells of the map it votes in
16citing papers in PubMed
–field-weighted citation impact
1 · What the graph read from it

What it found

Each row is one number read from the abstract, on the scale the paper reported it, with its interval. Left of the dashed line favours the treatment, right favours the comparator. Under each row is the sentence it came from. New to these charts? A ten-minute tutorial.

The abstract states no effect estimate the extractor could read, or names no intervention and outcome on the map, so this paper lights no cell and moves no belief. It is still indexed, cited and linked below.

2 · The registry

The trial behind it

Trials whose registry record cites this paper, or whose number appears in the abstract. A trial that started after this paper was published is citing it as background, not reporting it.

Neither the registry nor the abstract names a trial number. If this is a trial report, that itself is worth knowing.

3 · Its place in the literature

Who cites it

16 citing papers in PubMed.

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4 · The record

Corrections and comments

PubMed lists nothing against this paper. Absence here is not a guarantee, only a check that was made.

5 · Who and what money

Authors and funding

33 authors.

Min Tan *School of Optical and Electronic Information, Huazhong University of Science and Technology, Wuhan, 430074, China. mtan@hust.edu.cn.
Jiang XuDepartment of Electronic and Computer Engineering, The Hong Kong University of Science and Technology, Hong Kong, China. jiang.xu@ust.hk.
Siyang Liu *Chongqing United Micro-Electronics Center (CUMEC), Chongqing, 401332, China.
Junbo FengChongqing United Micro-Electronics Center (CUMEC), Chongqing, 401332, China. junbo.feng@cumec.cn.
Hua Zhang *Hisense Broadband Multimedia Technologies Co., Ltd., Qingdao, 266000, China. zhanghua8@hisense.com.
Chaonan YaoHisense Broadband Multimedia Technologies Co., Ltd., Qingdao, 266000, China.
Shixi Chen *Department of Electronic and Computer Engineering, The Hong Kong University of Science and Technology, Hong Kong, China.
Hangyu Guo *Institute of Microelectronics, Chinese Academy of Sciences, Beijing, 100029, China.
Gengshi Han *Institute of Microelectronics, Chinese Academy of Sciences, Beijing, 100029, China.
Zhanhao Wen *Institute of Microelectronics, Chinese Academy of Sciences, Beijing, 100029, China.
Bao Chen *Institute of Microelectronics, Chinese Academy of Sciences, Beijing, 100029, China.
Yu He *Institute of Microelectronics, Chinese Academy of Sciences, Beijing, 100029, China.
Xuqiang Zheng *Institute of Microelectronics, Chinese Academy of Sciences, Beijing, 100029, China. zhengxuqiang@ime.ac.cn.
Da Ming *School of Optical and Electronic Information, Huazhong University of Science and Technology, Wuhan, 430074, China.
Yaowen TuSchool of Optical and Electronic Information, Huazhong University of Science and Technology, Wuhan, 430074, China.
Qiang Fu *School of Optical and Electronic Information, Huazhong University of Science and Technology, Wuhan, 430074, China.
Nan QiState Key Laboratory of Superlattices and Microstructures, Institute of Semiconductors, Chinese Academy of Sciences, Beijing, 100083, China.
Dan Li *School of Microelectronics, Xi'an Jiaotong University, Xi'an, 710049, China. dan.li@xjtu.edu.cn.
Li GengSchool of Microelectronics, Xi'an Jiaotong University, Xi'an, 710049, China.
Song Wen *Institute of Microelectronics, Chinese Academy of Sciences, Beijing, 100029, China.
Fenghe YangZhangjiang Laboratory, Shanghai, 201210, China.
Huimin HeInstitute of Microelectronics, Chinese Academy of Sciences, Beijing, 100029, China.
Fengman LiuInstitute of Microelectronics, Chinese Academy of Sciences, Beijing, 100029, China.
Haiyun Xue *Institute of Microelectronics, Chinese Academy of Sciences, Beijing, 100029, China. xuehaiyun@ime.ac.cn.
Yuhang WangSchool of Optical and Electronic Information, Huazhong University of Science and Technology, Wuhan, 430074, China.
Ciyuan QiuThe State Key Laboratory of Advanced Optical Communication Systems and Networks, Department of Electronic Engineering, Shanghai Jiao Tong University, Shanghai, 200240, China. qiuciyuan@sjtu.edu.cn.
Guangcan Mi *Huawei Technologies Co., Ltd., Shenzhen, 440307, China.
Yanbo LiHuawei Technologies Co., Ltd., Shenzhen, 440307, China.
Tianhai ChangHuawei Technologies Co., Ltd., Shenzhen, 440307, China. changtianhai@huawei.com.
Mingche Lai *College of Computer, National University of Defense Technology, Changsha, 410073, China.
Luo ZhangCollege of Computer, National University of Defense Technology, Changsha, 410073, China. jiiftluo@nudt.edu.cn.
Qinfen HaoInstitute of Computing Technology, Chinese Academy of Sciences, Beijing, 100086, China. haoqinfen@ict.ac.cn.
Mengyuan QinInstitute of Computing Technology, Chinese Academy of Sciences, Beijing, 100086, China.

Funding

No grant is acknowledged in the PubMed record.

6 · The paper itself

Abstract

Due to the rise of 5G, IoT, AI, and high-performance computing applications, datacenter traffic has grown at a compound annual growth rate of nearly 30%. Furthermore, nearly three-fourths of the datacenter traffic resides within datacenters. The conventional pluggable optics increases at a much slower rate than that of datacenter traffic. The gap between application requirements and the capability of conventional pluggable optics keeps increasing, a trend that is unsustainable. Co-packaged optics (CPO) is a disruptive approach to increasing the interconnecting bandwidth density and energy efficiency by dramatically shortening the electrical link length through advanced packaging and co-optimization of electronics and photonics. CPO is widely regarded as a promising solution for future datacenter interconnections, and silicon platform is the most promising platform for large-scale integration. Leading international companies (e.g., Intel, Broadcom and IBM) have heavily investigated in CPO technology, an inter-disciplinary research field that involves photonic devices, integrated circuits design, packaging, photonic device modeling, electronic-photonic co-simulation, applications, and standardization. This review aims to provide the readers a comprehensive overview of the state-of-the-art progress of CPO in silicon platform, identify the key challenges, and point out the potential solutions, hoping to encourage collaboration between different research fields to accelerate the development of CPO technology.

Indexed as

Advanced packagingCo-packaged opticsCo-simulationExternal laserHigh-performance computingOptical power deliveryReceiverSilicon photonicsStandardizationTransmitter

Identifiers

PMID36939942
PMCPMC10027985

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LicenceCC BY
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Read underepoch 390

Registered trials

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Read under generation 80e0d062 · epoch 390. Bibliography from PubMed, PubMed Central and OpenAlex; grants from NIH RePORTER; trial links from ClinicalTrials.gov; estimates, votes and beliefs from the OpenQuestion graph.