ArticleRSC advances2023
Parametric study on conductive patterns by low-temperature sintering of micron silver ink.
Article in RSC advances, 2023. The graph could read no effect estimate from its abstract, so it casts no vote on the map. Cited by 2 papers.
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The abstract states no effect estimate the extractor could read, or names no intervention and outcome on the map, so this paper lights no cell and moves no belief. It is still indexed, cited and linked below.
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Who cites it
2 citing papers in PubMed.
- Scalable Synthesis of High-Density Ultrafine Spherical Silver Powders.Materials (Basel, Switzerland) · 2026Article
- Integrating High-Performance Flexible Wires with Strain Sensors for Wearable Human Motion Detection.Sensors (Basel, Switzerland) · 2024Article
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Authors and funding
4 authors.
Funding
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Abstract
The fabrication of dense conductive patterns was achieved by low-temperature sintering of 1-3 μm micron silver flakes. A small amount of 20-50 nm nanosilver particles were added in the gaps of the micron silver flakes. The effects of sintering temperature, holding time and heating rate on the morphological evolution and formation mechanism of the sintered silver pattern were investigated in detail. Interestingly, rapid sintering (RS) can be achieved by removing the heating process from 70 °C up to the sintering temperature. The electrical resistivity of the sintered silver patterns was 10.8 × 10
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Registered trials
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