Evidence map›Paper›PMID 36892156›Full record

ReviewACS nano2023

Technology Roadmap for Flexible Sensors.

Yifei Luo, Mohammad Reza Abidian, Jong-Hyun Ahn, Deji Akinwande, Anne M Andrews, Markus Antonietti, Zhenan Bao, Magnus Berggren, Christopher A Berkey, Christopher John Bettinger and 132 more

Abstract readReview
PubMed Full text at PMC Publisher
In one paragraph

Review in ACS nano, 2023. The graph could read no effect estimate from its abstract, so it casts no vote on the map. Cited by 278 papers, 1 of them a synthesis that pooled it.

0numbers the graph read from it
0cells of the map it votes in
278citing papers in PubMed, 1 pooled it
–field-weighted citation impact
1 · What the graph read from it

What it found

Each row is one number read from the abstract, on the scale the paper reported it, with its interval. Left of the dashed line favours the treatment, right favours the comparator. Under each row is the sentence it came from. New to these charts? A ten-minute tutorial.

The abstract states no effect estimate the extractor could read, or names no intervention and outcome on the map, so this paper lights no cell and moves no belief. It is still indexed, cited and linked below.

2 · The registry

The trial behind it

Trials whose registry record cites this paper, or whose number appears in the abstract. A trial that started after this paper was published is citing it as background, not reporting it.

Neither the registry nor the abstract names a trial number. If this is a trial report, that itself is worth knowing.

3 · Its place in the literature

Who cites it

278 citing papers in PubMed, 1 synthesis or guideline pooled it.

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  14. A Supramolecular Reversible and Anisotropic Conductive Adhesive for Flexible Electronics.Advanced science (Weinheim, Baden-Wurttemberg, Germany) · 2026
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218 more citing papers are in PubMed but not listed here.

4 · The record

Corrections and comments

PubMed lists nothing against this paper. Absence here is not a guarantee, only a check that was made.

5 · Who and what money

Authors and funding

142 authors.

Yifei LuoInstitute of Materials Research and Engineering (IMRE), Agency for Science, Technology and Research (A*STAR), 2 Fusionopolis Way, #08-03 Innovis, Singapore 138634, Republic of Singapore.ORCID 0000-0002-4454-6318
Mohammad Reza AbidianDepartment of Biomedical Engineering, University of Houston, Houston, Texas 77024, United States.
Jong-Hyun AhnSchool of Electrical and Electronic Engineering, Yonsei University, Seoul 03722, Republic of Korea.ORCID 0000-0002-8135-7719
Deji AkinwandeDepartment of Electrical and Computer Engineering, The University of Texas at Austin, Austin, Texas 78712, United States.ORCID 0000-0001-7133-5586
Anne M AndrewsDepartment of Chemistry and Biochemistry, California NanoSystems Institute, and Department of Psychiatry and Biobehavioral Sciences, Semel Institute for Neuroscience and Human Behavior, and Hatos Center for Neuropharmacology, University of California, Los Angeles, Los Angeles, California 90095, United States.ORCID 0000-0002-1961-4833
Markus AntoniettiColloid Chemistry Department, Max Planck Institute of Colloids and Interfaces, 14476 Potsdam, Germany.ORCID 0000-0002-8395-7558
Zhenan BaoDepartment of Chemical Engineering, Stanford University, Stanford, California 94305, United States.ORCID 0000-0002-0972-1715
Magnus BerggrenLaboratory of Organic Electronics, Department of Science and Technology, Campus Norrköping, Linköping University, 83 Linköping, Sweden.ORCID 0000-0001-5154-0291
Christopher A BerkeyDepartment of Materials Science and Engineering, Stanford University, Stanford, California 94301, United States.
Christopher John BettingerDepartment of Biomedical Engineering and Department of Materials Science and Engineering, Carnegie Mellon University, Pittsburgh, Pennsylvania 15213, United States.ORCID 0000-0002-6564-5681
Jun ChenDepartment of Bioengineering, University of California, Los Angeles, Los Angeles, California 90095, United States.ORCID 0000-0002-3439-0495
Peng ChenSchool of Chemistry, Chemical Engineering and Biotechnology, Nanyang Technological University, Singapore 637457, Singapore.
Wenlong ChengNanobionics Group, Department of Chemical and Biological Engineering, Monash University, Clayton, Australia, 3800.ORCID 0000-0002-2346-4970
Xu ChengApplied Mechanics Laboratory, Department of Engineering Mechanics, Laboratory of Flexible Electronics Technology, Tsinghua University, Beijing 100084, PR China.
Seon-Jin ChoiDivision of Materials of Science and Engineering, Hanyang University, 222 Wangsimni-ro, Seongdong-gu, Seoul 04763, Republic of Korea.ORCID 0000-0001-8567-0668
Alex ChortosSchool of Mechanical Engineering, Purdue University, West Lafayette, Indiana 47906, United States.ORCID 0000-0003-3976-5257
Canan DagdevirenMedia Lab, Massachusetts Institute of Technology, Cambridge, Massachusetts 02139, United States.ORCID 0000-0002-2032-792X
Reinhold H DauskardtDepartment of Materials Science and Engineering, Stanford University, Stanford, California 94301, United States.
Chong-An DiBeijing National Laboratory for Molecular Sciences, CAS Key Laboratory of Organic Solids, Institute of Chemistry, Chinese Academy of Sciences, Beijing 100190, China.ORCID 0000-0002-6183-1321
Michael D DickeyDepartment of Chemical and Biomolecular Engineering, North Carolina State University, Raleigh, North Carolina 27606, United States.ORCID 0000-0003-1251-1871
Xiangfeng DuanDepartment of Chemistry and Biochemistry, California NanoSystems Institute, University of California, Los Angeles, Los Angeles, California 90095, United States.ORCID 0000-0002-4321-6288
Antonio FacchettiDepartment of Chemistry and the Materials Research Center, Northwestern University, Evanston, Illinois 60208, United States.ORCID 0000-0002-8175-7958
Zhiyong FanDepartment of Electronic and Computer Engineering and Department of Chemical and Biological Engineering, The Hong Kong University of Science and Technology, Clear Water Bay, Kowloon, Hong Kong SAR, China.ORCID 0000-0002-5397-0129
Yin FangSchool of Chemistry, Chemical Engineering and Biotechnology, Nanyang Technological University, Singapore 637457, Singapore.ORCID 0000-0003-4688-6700
Jianyou FengState Key Laboratory of Molecular Engineering of Polymers, Department of Macromolecular Science, and Laboratory of Advanced Materials, Fudan University, Shanghai 200438, PR China.
Xue FengLaboratory of Flexible Electronics Technology, Department of Engineering Mechanics, Tsinghua University, Beijing 100084, China.ORCID 0000-0001-9242-8474
Huajian GaoSchool of Mechanical and Aerospace Engineering, Nanyang Technological University, Singapore 639798, Singapore.ORCID 0000-0002-8656-846X
Wei GaoAndrew and Peggy Cherng Department of Medical Engineering, California Institute of Technology, Pasadena, California, 91125, United States.ORCID 0000-0002-8503-4562
Xiwen GongDepartment of Chemical Engineering, Department of Materials Science and Engineering, Department of Electrical Engineering and Computer Science, Applied Physics Program, and Macromolecular Science and Engineering Program, University of Michigan, Ann Arbor, Michigan, 48109 United States.ORCID 0000-0003-4004-1299
Chuan Fei GuoDepartment of Materials Science and Engineering, Southern University of Science and Technology, Shenzhen 518055, China.
Xiaojun GuoNational Key Laboratory of Science and Technology on Micro/Nano Fabrication, School of Electronic Information and Electrical Engineering, Shanghai Jiao Tong University, Shanghai 200240, China.
Martin C HartelDepartment of Bioengineering, University of California, Los Angeles, Los Angeles, California 90095, United States.
Zihan HeBeijing National Laboratory for Molecular Sciences, CAS Key Laboratory of Organic Solids, Institute of Chemistry, Chinese Academy of Sciences, Beijing 100190, China.
John S HoInstitute for Health Innovation and Technology, National University of Singapore, Singapore 117599, Singapore.ORCID 0000-0002-9458-9033
Youfan HuSchool of Electronics and Center for Carbon-Based Electronics, Peking University, Beijing 100871, China.ORCID 0000-0001-9798-1631
Qiyao HuangSchool of Fashion and Textiles, The Hong Kong Polytechnic University, Hung Hom, Kowloon, Hong Kong SAR, China.
Yu HuangDepartment of Materials Science and Engineering, California NanoSystems Institute, University of California, Los Angeles, Los Angeles, California 90095, United States.ORCID 0000-0003-1793-0741
Fengwei HuoKey Laboratory of Flexible Electronics (KLOFE) and Institute of Advanced Materials (IAM), Nanjing Tech University (NanjingTech), 30 South Puzhu Road, Nanjing 211816, PR China.ORCID 0000-0002-5318-4267
Muhammad M Hussainmmh Labs, Elmore Family School of Electrical and Computer Engineering, Purdue University, West Lafayette, Indiana 47906, United States.
Ali JaveyElectrical Engineering and Computer Sciences, University of California, Berkeley, California 94720, United States.
Unyong JeongDepartment of Materials Science and Engineering, Pohang University of Science and Engineering (POSTECH), Pohang, Gyeong-buk 37673, Korea.ORCID 0000-0002-7519-7595
Chen JiangDepartment of Electronic Engineering, Tsinghua University, Beijing 100084, China.
Xingyu JiangDepartment of Biomedical Engineering, Southern University of Science and Technology, No 1088, Xueyuan Road, Xili, Nanshan District, Shenzhen, Guangdong 518055, PR China.ORCID 0000-0002-5008-4703
Jiheong KangDepartment of Materials Science and Engineering, Korea Advanced Institute of Science and Technology (KAIST), Daejeon 34141, Republic of Korea.
Daniil KarnaushenkoResearch Center for Materials, Architectures and Integration of Nanomembranes (MAIN), Chemnitz University of Technology, Chemnitz 09126, Germany.
Ali KhademhosseiniTerasaki Institute for Biomedical Innovation, Los Angeles, CA, USA.
Dae-Hyeong KimCenter for Nanoparticle Research, Institute for Basic Science (IBS), School of Chemical and Biological Engineering, Seoul National University, Seoul 08826, Republic of Korea.ORCID 0000-0002-4722-1893
Il-Doo KimDepartment of Materials Science and Engineering, Korea Advanced Institute of Science and Technology (KAIST), 291 Daehak-ro, Yuseong-gu, Daejeon 34141, Republic of Korea.ORCID 0000-0002-9970-2218
Dmitry KireevDepartment of Electrical and Computer Engineering, The University of Texas at Austin, Austin, Texas 78712, United States.ORCID 0000-0003-1499-5435
Lingxuan KongSchool of Chemistry, Chemical Engineering and Biotechnology, Nanyang Technological University, Singapore 637457, Singapore.
Chengkuo LeeDepartment of Electrical and Computer Engineering, National University of Singapore, Singapore 117583, Singapore.ORCID 0000-0002-8886-3649
Nae-Eung LeeSchool of Advanced Materials Science and Engineering, Sungkyunkwan University, Suwon, Kyunggi-do 16419, Republic of Korea.ORCID 0000-0002-6539-5010
Pooi See LeeSchool of Materials Science and Engineering, Nanyang Technological University, Singapore 639798, Singapore.ORCID 0000-0003-1383-1623
Tae-Woo LeeDepartment of Materials Science and Engineering, Seoul National University, Seoul 08826, Republic of Korea.ORCID 0000-0002-6449-6725
Fengyu LiCollege of Chemistry and Materials Science, Jinan University, Guangzhou, Guangdong 510632, China.
Jinxing LiDepartment of Biomedical Engineering, Department of Electrical and Computer Engineering, Neuroscience Program, BioMolecular Science Program, and Institute for Quantitative Health Science and Engineering, Michigan State University, East Lansing, Michigan 48823, United States.
Cuiyuan LiangSchool of Chemistry and Chemical Engineering, Harbin Institute of Technology, Harbin, Heilongjiang 150001, China.
Chwee Teck LimDepartment of Biomedical Engineering, National University of Singapore, Singapore 117583, Singapore.ORCID 0000-0003-4019-9782
Yuanjing LinSchool of Microelectronics, Southern University of Science and Technology, Shenzhen 518055, China.
Darren J LipomiDepartment of Nano and Chemical Engineering, University of California, San Diego, La Jolla, California 92093-0448, United States.ORCID 0000-0002-5808-7765
Jia LiuJohn A. Paulson School of Engineering and Applied Sciences, Harvard University, Boston, Massachusetts, 02134, United States.ORCID 0000-0003-2217-6982
Kai LiuSchool of Chemistry and Chemical Engineering, Frontiers Science Center for Transformative Molecules, Shanghai Jiao Tong University, Shanghai 200240, PR China.ORCID 0000-0002-8503-7659
Nan LiuBeijing Key Laboratory of Energy Conversion and Storage Materials, College of Chemistry, Beijing Normal University, Beijing 100875, PR China.ORCID 0000-0002-1793-7372
Ren LiuJohn A. Paulson School of Engineering and Applied Sciences, Harvard University, Boston, Massachusetts, 02134, United States.
Yuxin LiuInstitute of Materials Research and Engineering (IMRE), Agency for Science, Technology and Research (A*STAR), 2 Fusionopolis Way, #08-03 Innovis, Singapore 138634, Republic of Singapore.
Yuxuan LiuDepartment of Mechanical and Aerospace Engineering, North Carolina State University, Raleigh, North Carolina 27695, United States.ORCID 0000-0001-8196-1054
Zhiyuan LiuNeural Engineering Centre, Shenzhen Institute of Advanced Technology, Chinese Academy of Sciences, Shenzhen, China 518055.ORCID 0000-0001-9231-8195
Zhuangjian LiuInstitute of High Performance Computing (IHPC), Agency for Science, Technology and Research (A*STAR), 1 Fusionopolis Way, #16-16 Connexis, Singapore 138632, Republic of Singapore.
Xian Jun LohInstitute of Materials Research and Engineering (IMRE), Agency for Science, Technology and Research (A*STAR), 2 Fusionopolis Way, #08-03 Innovis, Singapore 138634, Republic of Singapore.ORCID 0000-0001-8118-6502
Nanshu LuDepartment of Aerospace Engineering and Engineering Mechanics, Department of Electrical and Computer Engineering, Department of Mechanical Engineering, Department of Biomedical Engineering, Texas Materials Institute, The University of Texas at Austin, Austin, Texas 78712, United States.ORCID 0000-0002-3595-3851
Zhisheng LvInstitute of Materials Research and Engineering (IMRE), Agency for Science, Technology and Research (A*STAR), 2 Fusionopolis Way, #08-03 Innovis, Singapore 138634, Republic of Singapore.
Shlomo MagdassiInstitute of Chemistry and the Center for Nanoscience and Nanotechnology, The Hebrew University of Jerusalem, Jerusalem 9190401, Israel.ORCID 0000-0002-6794-0553
George G MalliarasElectrical Engineering Division, Department of Engineering, University of Cambridge CB3 0FA, Cambridge United Kingdom.ORCID 0000-0002-4582-8501
Naoji MatsuhisaInstitute of Industrial Science, The University of Tokyo, 4-6-1 Komaba, Meguro-ku, Tokyo 153-8505, Japan.ORCID 0000-0002-5978-2778
Arokia NathanDarwin College, University of Cambridge, Cambridge CB3 9EU, United Kingdom.
Simiao NiuDepartment of Biomedical Engineering, Rutgers University, Piscataway, New Jersey 08854, United States.
Jieming PanDepartment of Electrical and Computer Engineering, National University of Singapore, Singapore 117583, Singapore.ORCID 0000-0002-9996-2984
Changhyun PangSchool of Chemical Engineering and Samsung Advanced Institute for Health Science and Technology, Sungkyunkwan University, Suwon 16419, Republic of Korea.ORCID 0000-0001-8339-7880
Qibing PeiDepartment of Materials Science and Engineering, Department of Mechanical and Aerospace Engineering, California NanoSystems Institute, University of California, Los Angeles, Los Angeles, California 90095, United States.ORCID 0000-0003-1669-1734
Huisheng PengState Key Laboratory of Molecular Engineering of Polymers, Department of Macromolecular Science, and Laboratory of Advanced Materials, Fudan University, Shanghai 200438, PR China.ORCID 0000-0003-3746-8494
Dianpeng QiSchool of Chemistry and Chemical Engineering, Harbin Institute of Technology, Harbin, Heilongjiang 150001, China.ORCID 0000-0002-8245-8183
Huaying RenDepartment of Chemistry and Biochemistry, University of California, Los Angeles, Los Angeles, California, 90095, United States.ORCID 0000-0003-4785-8031
John A RogersQuerrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, Illinois 60208, United States.ORCID 0000-0002-2980-3961
Aaron RoweBecton, Dickinson and Company, 1268 N. Lakeview Avenue, Anaheim, California 92807, United States.
Oliver G SchmidtResearch Center for Materials, Architectures and Integration of Nanomembranes (MAIN), Chemnitz University of Technology, Chemnitz 09126, Germany.
Tsuyoshi SekitaniThe Institute of Scientific and Industrial Research (SANKEN), Osaka University, Osaka, Japan 5670047.ORCID 0000-0003-1070-2738
Dae-Gyo SeoDepartment of Materials Science and Engineering, Seoul National University, Seoul 08826, Republic of Korea.
Guozhen ShenSchool of Integrated Circuits and Electronics, Beijing Institute of Technology, Beijing 100081, China.ORCID 0000-0002-9755-1647
Xing ShengDepartment of Electronic Engineering, Beijing National Research Center for Information Science and Technology, Institute for Precision Medicine, Center for Flexible Electronics Technology, and IDG/McGovern Institute for Brain Research, Tsinghua University, Beijing, 100084, China.ORCID 0000-0002-8744-1700
Qiongfeng ShiDepartment of Electrical and Computer Engineering, National University of Singapore, Singapore 117583, Singapore.
Takao SomeyaDepartment of Electrical Engineering and Information Systems, Graduate School of Engineering, The University of Tokyo, Tokyo 113-8656, Japan.ORCID 0000-0003-3051-1138
Yanlin SongKey Laboratory of Green Printing, Institute of Chemistry, Chinese Academy of Sciences, Beijing, Beijing 100190, China.ORCID 0000-0002-0267-3917
Eleni StavrinidouLaboratory of Organic Electronics, Department of Science and Technology, Linköping University, SE-601 74 Norrkoping, Sweden.ORCID 0000-0002-9357-776X
Meng SuKey Laboratory of Green Printing, Institute of Chemistry, Chinese Academy of Sciences, Beijing, Beijing 100190, China.
Xuemei SunState Key Laboratory of Molecular Engineering of Polymers, Department of Macromolecular Science, and Laboratory of Advanced Materials, Fudan University, Shanghai 200438, PR China.ORCID 0000-0002-2583-8593
Kuniharu TakeiDepartment of Physics and Electronics, Osaka Metropolitan University, Sakai, Osaka 599-8531, Japan.ORCID 0000-0001-9166-3747
Xiao-Ming TaoResearch Institute for Intelligent Wearable Systems, School of Fashion and Textiles, Hong Kong Polytechnic University, Hong Kong, China.ORCID 0000-0002-2406-0695
Benjamin C K TeeMaterials Science and Engineering, National University of Singapore, Singapore 117575, Singapore.ORCID 0000-0002-9180-4105
Aaron Voon-Yew TheanDepartment of Electrical and Computer Engineering, National University of Singapore, Singapore 117583, Singapore.
Tran Quang TrungSchool of Advanced Materials Science and Engineering, Sungkyunkwan University, Suwon, Kyunggi-do 16419, Republic of Korea.
Changjin WanSchool of Electronic Science and Engineering, Nanjing University, Nanjing 210023, China.
Huiliang WangDepartment of Biomedical Engineering, University of Texas at Austin, Austin, Texas 78712, United States.ORCID 0000-0003-4063-270X
Joseph WangDepartment of Nanoengineering, University of California, San Diego, California 92093, United States.
Ming WangFrontier Institute of Chip and System, State Key Laboratory of Integrated Chip and Systems, Zhangjiang Fudan International Innovation Center, Fudan University, Shanghai, 200433, China.
Sihong WangPritzker School of Molecular Engineering, The University of Chicago, Chicago, Illinois, 60637, United States.
Ting WangState Key Laboratory of Organic Electronics and Information Displays and Jiangsu Key Laboratory for Biosensors, Institute of Advanced Materials (IAM), Nanjing University of Posts and Telecommunications, 9 Wenyuan Road, Nanjing 210023, China.
Zhong Lin WangBeijing Institute of Nanoenergy and Nanosystems, Chinese Academy of Sciences, Beijing 100083, China.ORCID 0000-0002-5530-0380
Paul S WeissCalifornia NanoSystems Institute, Department of Chemistry and Biochemistry, Department of Bioengineering, and Department of Materials Science and Engineering, University of California, Los Angeles, Los Angeles, California 90095, United States.ORCID 0000-0001-5527-6248
Hanqi WenSchool of Chemistry, Chemical Engineering and Biotechnology, Nanyang Technological University, Singapore 637457, Singapore.
Sheng XuDepartment of Nanoengineering, Department of Electrical and Computer Engineering, Materials Science and Engineering Program, and Department of Bioengineering, University of California San Diego, La Jolla, California, 92093, United States.
Tailin XuSchool of Biomedical Engineering, Health Science Center, Shenzhen University, Shenzhen, Guangdong, 518060, PR China.ORCID 0000-0003-4037-2856
Hongping YanDepartment of Chemical Engineering, Stanford University, Stanford, California 94305, United States.ORCID 0000-0001-6235-4523
Xuzhou YanSchool of Chemistry and Chemical Engineering, Frontiers Science Center for Transformative Molecules, Shanghai Jiao Tong University, Shanghai 200240, PR China.ORCID 0000-0002-6114-5743
Hui YangTianjin Key Laboratory of Molecular Optoelectronic Sciences, Department of Chemistry, School of Science, Tianjin University, Tianjin, China, 300072.
Le YangInstitute of Materials Research and Engineering (IMRE), Agency for Science, Technology and Research (A*STAR), 2 Fusionopolis Way, #08-03 Innovis, Singapore 138634, Republic of Singapore.ORCID 0000-0002-3697-171X
Shuaijian YangSchool of Biomedical Sciences, Faculty of Biological Sciences, University of Leeds, Leeds, LS2 9JT, United Kingdom.
Lan YinSchool of Materials Science and Engineering, The Key Laboratory of Advanced Materials of Ministry of Education, State Key Laboratory of New Ceramics and Fine Processing, and Center for Flexible Electronics Technology, Tsinghua University, Beijing, 100084, China.ORCID 0000-0001-7306-4628
Cunjiang YuDepartment of Engineering Science and Mechanics, Department of Biomedical Engineering, Department of Material Science and Engineering, Materials Research Institute, Pennsylvania State University, University Park, Pennsylvania, 16802, United States.
Guihua YuMaterials Science and Engineering Program and Walker Department of Mechanical Engineering, The University of Texas at Austin, Austin, Texas, 78712, United States.ORCID 0000-0002-3253-0749
Jing YuSchool of Materials Science and Engineering, Nanyang Technological University, Singapore 639798, Singapore.ORCID 0000-0002-4288-951X
Shu-Hong YuDepartment of Chemistry, Institute of Biomimetic Materials and Chemistry, Hefei National Research Center for Physical Science at the Microscale, University of Science and Technology of China, Hefei 230026, China.ORCID 0000-0003-3732-1011
Xinge YuDepartment of Biomedical Engineering, City University of Hong Kong, Hong Kong, China.ORCID 0000-0003-0522-1171
Evgeny ZamburgDepartment of Electrical and Computer Engineering, National University of Singapore, Singapore 117583, Singapore.
Haixia ZhangNational Key Laboratory of Science and Technology on Micro/Nano Fabrication; Beijing Advanced Innovation Center for Integrated Circuits, School of Integrated Circuits, Peking University, Beijing 100871, China.ORCID 0000-0003-4565-4123
Xiangyu ZhangDepartment of Electrical and Computer Engineering, National University of Singapore, Singapore 117583, Singapore.
Xiaosheng ZhangSchool of Electronic Science and Engineering, University of Electronic Science and Technology of China, Chengdu 611731, China.
Xueji ZhangSchool of Biomedical Engineering, Health Science Center, Shenzhen University, Shenzhen, Guangdong 518060, PR China.ORCID 0000-0002-0035-3821
Yihui ZhangApplied Mechanics Laboratory, Department of Engineering Mechanics; Laboratory of Flexible Electronics Technology, Tsinghua University, Beijing 100084, PR China.
Yu ZhangDepartment of Electrical and Computer Engineering, National University of Singapore, Singapore 117583, Singapore.
Siyuan ZhaoJohn A. Paulson School of Engineering and Applied Sciences, Harvard University, Boston, Massachusetts, 02134, United States.ORCID 0000-0002-2658-3414
Xuanhe ZhaoDepartment of Mechanical Engineering, Department of Civil and Environmental Engineering, Massachusetts Institute of Technology, Cambridge, Massachusetts, 02139, United States.ORCID 0000-0001-5387-6186
Yuanjin ZhengCenter for Integrated Circuits and Systems, School of Electrical and Electronic Engineering, Nanyang Technological University, 50 Nanyang Avenue, Singapore 639798, Singapore.
Yu-Qing ZhengNational Key Laboratory of Science and Technology on Micro/Nano Fabrication; School of Integrated Circuits, Peking University, Beijing 100871, China.ORCID 0000-0003-3727-565X
Zijian ZhengDepartment of Applied Biology and Chemical Technology, Faculty of Science, Research Institute for Intelligent Wearable Systems, Research Institute for Smart Energy, The Hong Kong Polytechnic University, Hung Hom, Kowloon, Hong Kong SAR, China.
Tao ZhouCenter for Neural Engineering, Department of Engineering Science and Mechanics, The Huck Institutes of the Life Sciences, Materials Research Institute, The Pennsylvania State University, University Park, Pennsylvania 16802, United States.ORCID 0000-0002-6507-8912
Bowen ZhuKey Laboratory of 3D Micro/Nano Fabrication and Characterization of Zhejiang Province, School of Engineering, Westlake University, Hangzhou 310024, China.ORCID 0000-0001-7534-9723
Ming ZhuInstitute for Digital Molecular Analytics and Science (IDMxS), Nanyang Technological University, 59 Nanyang Drive, Singapore 636921, Singapore.
Rong ZhuDepartment of Precision Instrument, Tsinghua University, Beijing 100084, China.ORCID 0000-0001-5363-9519
Yangzhi ZhuTerasaki Institute for Biomedical Innovation, Los Angeles, California, 90064, United States.ORCID 0000-0003-2920-3365
Yong ZhuDepartment of Mechanical and Aerospace Engineering, Department of Materials Science and Engineering, and Department of Biomedical Engineering, North Carolina State University, Raleigh, North Carolina 27695, United States.
Guijin ZouInstitute of High Performance Computing (IHPC), Agency for Science, Technology and Research (A*STAR), 1 Fusionopolis Way, #16-16 Connexis, Singapore 138632, Republic of Singapore.ORCID 0000-0003-0047-7012
Xiaodong ChenInstitute of Materials Research and Engineering (IMRE), Agency for Science, Technology and Research (A*STAR), 2 Fusionopolis Way, #08-03 Innovis, Singapore 138634, Republic of Singapore.ORCID 0000-0002-3312-1664

Funding

Micro- to Nanoscale Neurochemical SensorsR01DA045550 · NIDA · UNIVERSITY OF CALIFORNIA LOS ANGELES · PI ANDREWS, ANNE MILASINCIC · 2017 to 2021
$5.8M
SCH: A personalized wearable rehabilitation sensing system for stroke survivorsR01HD108473 · NICHD · NORTH CAROLINA STATE UNIVERSITY RALEIGH · PI BARATTA, JOHN, BOZKURT, ALPER · 2021 to 2024
$1.1M
NICHD NIH HHS R01 HD108473NIDA NIH HHS R01 DA045550
6 · The paper itself

Abstract

Humans rely increasingly on sensors to address grand challenges and to improve quality of life in the era of digitalization and big data. For ubiquitous sensing, flexible sensors are developed to overcome the limitations of conventional rigid counterparts. Despite rapid advancement in bench-side research over the last decade, the market adoption of flexible sensors remains limited. To ease and to expedite their deployment, here, we identify bottlenecks hindering the maturation of flexible sensors and propose promising solutions. We first analyze challenges in achieving satisfactory sensing performance for real-world applications and then summarize issues in compatible sensor-biology interfaces, followed by brief discussions on powering and connecting sensor networks. Issues en route to commercialization and for sustainable growth of the sector are also analyzed, highlighting environmental concerns and emphasizing nontechnical issues such as business, regulatory, and ethical considerations. Additionally, we look at future intelligent flexible sensors. In proposing a comprehensive roadmap, we hope to steer research efforts towards common goals and to guide coordinated development strategies from disparate communities. Through such collaborative efforts, scientific breakthroughs can be made sooner and capitalized for the betterment of humanity.

Indexed as

Wearable Electronic DevicesHumansQuality of Lifebioelectronicsbody area sensor networksconformable sensorsflexible electronicshuman-machine interfacesmechanics engineeringsoft materialssustainable electronicstechnology translation

Identifiers

PMID36892156
PMCPMC11223676

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