ArticleMicromachines2023
Conduction Conditions for Self-Healing of Metal Interconnect Using Copper Microparticles Dispersed with Silicone Oil.
Article in Micromachines, 2023. The graph could read no effect estimate from its abstract, so it casts no vote on the map. Not yet cited in PubMed.
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2 authors.
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Abstract
This study clarifies the conditions for the bridging and conduction of a gap on a metal interconnect using copper microparticles dispersed with silicon oil. An AC voltage applied to a metal interconnect with a gap covered by a dispersion of metal microparticles traps the metal microparticles in the gap owing to the influence of a dielectrophoretic force on the interconnect, thus forming a metal microparticle chain. The current was tuned independently of the applied voltage by changing the external resistance. An AC voltage of 32 kHz was applied to a 10 µm wide gap on a metal interconnect covered with 3 µm diameter copper microparticles dispersed with silicone oil. Consequently, the copper microparticle chains physically bridged the interconnect and exhibited electrical conductivity at an applied voltage of 14 V
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