ArticleMicromachines2023
MEMS Reliability: On-Chip Testing for the Characterization of the Out-of-Plane Polysilicon Strength.
Article in Micromachines, 2023. The graph could read no effect estimate from its abstract, so it casts no vote on the map. Cited by 2 papers.
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The abstract states no effect estimate the extractor could read, or names no intervention and outcome on the map, so this paper lights no cell and moves no belief. It is still indexed, cited and linked below.
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Who cites it
2 citing papers in PubMed.
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Authors and funding
7 authors.
Funding
No grant is acknowledged in the PubMed record.
Abstract
Polycrystalline silicon is a brittle material, and its strength results are stochastically linked to microscale (or even nanoscale) defects, possibly dependent on the grain size and morphology. In this paper, we focus on the out-of-plane tensile strength of columnar polysilicon. The investigation has been carried out through a combination of a newly proposed setup for on-chip testing and finite element analyses to properly interpret the collected data. The experiments have aimed to provide a static loading to a stopper, exploiting electrostatic actuation to move a massive shuttle against it, up to failure. The failure mechanism observed in the tested devices has been captured by the numerical simulations. The data have been then interpreted by the Weibull theory for three different stopper sizes, leading to an estimation of the reference out-of-plane strength of polysilicon on the order of 2.8-3.0 GPa, in line with other results available in the literature.
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