Evidence map›Paper›PMID 36771893›Full record

ArticlePolymers2023

Characterization of Mechanical, Electrical and Thermal Properties of Bismaleimide Resins Based on Different Branched Structures.

Haihui Cai, Jiahao Shi, Xiaorui Zhang, Zhou Yang, Ling Weng, Qingye Wang, Shaohui Yan, Lida Yu, Junlong Yang

Abstract read
PubMed Full text at PMC Publisher
In one paragraph

Article in Polymers, 2023. The graph could read no effect estimate from its abstract, so it casts no vote on the map. Not yet cited in PubMed.

0numbers the graph read from it
0cells of the map it votes in
0citing papers in PubMed
–field-weighted citation impact
1 · What the graph read from it

What it found

Each row is one number read from the abstract, on the scale the paper reported it, with its interval. Left of the dashed line favours the treatment, right favours the comparator. Under each row is the sentence it came from. New to these charts? A ten-minute tutorial.

The abstract states no effect estimate the extractor could read, or names no intervention and outcome on the map, so this paper lights no cell and moves no belief. It is still indexed, cited and linked below.

2 · The registry

The trial behind it

Trials whose registry record cites this paper, or whose number appears in the abstract. A trial that started after this paper was published is citing it as background, not reporting it.

Neither the registry nor the abstract names a trial number. If this is a trial report, that itself is worth knowing.

3 · Its place in the literature

Who cites it

0 citing papers in PubMed.

No citing paper in PubMed yet.

4 · The record

Corrections and comments

PubMed lists nothing against this paper. Absence here is not a guarantee, only a check that was made.

5 · Who and what money

Authors and funding

9 authors.

Haihui CaiSchool of Materials Science and Engineering, Harbin University of Science and Technology, Harbin 150040, China.
Jiahao ShiSchool of Materials Science and Engineering, Harbin University of Science and Technology, Harbin 150040, China.
Xiaorui ZhangSchool of Materials Science and Engineering, Harbin University of Science and Technology, Harbin 150040, China.
Zhou YangSchool of Materials Science and Engineering, Harbin University of Science and Technology, Harbin 150040, China.
Ling WengSchool of Materials Science and Engineering, Harbin University of Science and Technology, Harbin 150040, China.
Qingye WangSchool of Materials Science and Engineering, Harbin University of Science and Technology, Harbin 150040, China.
Shaohui YanSchool of Materials Science and Engineering, Harbin University of Science and Technology, Harbin 150040, China.
Lida YuSchool of Materials Science and Engineering, Harbin University of Science and Technology, Harbin 150040, China.
Junlong YangHarbin Electric Machinery Company Limited, Harbin 150040, China.

Funding

Open Project Foundation KFM202107Young Foundation UNPYSCT-2020182
6 · The paper itself

Abstract

Bismaleimide (BMI) resin is an excellent performance resin, mainly due to its resistance to the effect of heat and its insulating properties. However, its lack of toughness as a cured product hampers its application in printed circuit boards (PCBs). Herein, a branched structure via Michael addition was introduced to a BMI system to reinforce its toughness. Compared with a pure BMI sample, the flexural strength of the modified BMI was enhanced, and its maximum value of 189 MPa increased by 216%. The flexural modulus of the cured sample reached 5.2 GPa. Using a scanning electron microscope, the fracture surfaces of BMI samples and a transition from brittle fracture to ductile fracture were observed. Furthermore, both the dielectric constant and the dielectric loss of the cured resin decreased. The breakdown field strength was raised to 37.8 kV/mm and the volume resistivity was improved to varying degrees. Consequently, the resulting modified BMI resin has the potential for wide application in high-frequency and low-dielectric resin substrates, and the modified BMI resin with a structure including three different diamines can meet the needs of various applications.

Indexed as

BMI resinbranched structureelectrical propertiesflexural modulustoughness

Identifiers

PMID36771893
PMCPMC9919665

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Read under generation 80e0d062 · epoch 390. Bibliography from PubMed, PubMed Central and OpenAlex; grants from NIH RePORTER; trial links from ClinicalTrials.gov; estimates, votes and beliefs from the OpenQuestion graph.