Evidence map›Paper›PMID 36614433›Full record

ArticleMaterials (Basel, Switzerland)2022

Effectiveness of Dimple Microtextured Copper Substrate on Performance of Sn-0.7Cu Solder Alloy.

Siti Faqihah Roduan, Juyana A Wahab, Mohd Arif Anuar Mohd Salleh, Nurul Aida Husna Mohd Mahayuddin, Mohd Mustafa Al Bakri Abdullah, Aiman Bin Mohd Halil, Amira Qistina Syamimi Zaifuddin, Mahadzir Ishak Muhammad, Andrei Victor Sandu, Mădălina Simona Baltatu and 1 more

Abstract read
PubMed Full text at PMC Publisher
In one paragraph

Article in Materials (Basel, Switzerland), 2022. The graph could read no effect estimate from its abstract, so it casts no vote on the map. Cited by 1 paper.

0numbers the graph read from it
0cells of the map it votes in
1citing papers in PubMed
–field-weighted citation impact
1 · What the graph read from it

What it found

Each row is one number read from the abstract, on the scale the paper reported it, with its interval. Left of the dashed line favours the treatment, right favours the comparator. Under each row is the sentence it came from. New to these charts? A ten-minute tutorial.

The abstract states no effect estimate the extractor could read, or names no intervention and outcome on the map, so this paper lights no cell and moves no belief. It is still indexed, cited and linked below.

2 · The registry

The trial behind it

Trials whose registry record cites this paper, or whose number appears in the abstract. A trial that started after this paper was published is citing it as background, not reporting it.

Neither the registry nor the abstract names a trial number. If this is a trial report, that itself is worth knowing.

3 · Its place in the literature

Who cites it

1 citing paper in PubMed.

  1. Article
4 · The record

Corrections and comments

PubMed lists nothing against this paper. Absence here is not a guarantee, only a check that was made.

5 · Who and what money

Authors and funding

11 authors.

Siti Faqihah RoduanFaculty of Chemical Engineering and Technology, Kompleks Pusat Pengajian Jejawi 2, Universiti Malaysia Perlis (UniMAP), Arau 02600, Malaysia.
Juyana A WahabFaculty of Chemical Engineering and Technology, Kompleks Pusat Pengajian Jejawi 2, Universiti Malaysia Perlis (UniMAP), Arau 02600, Malaysia.ORCID 0000-0002-8234-1364
Mohd Arif Anuar Mohd SallehFaculty of Chemical Engineering and Technology, Kompleks Pusat Pengajian Jejawi 2, Universiti Malaysia Perlis (UniMAP), Arau 02600, Malaysia.
Nurul Aida Husna Mohd MahayuddinFaculty of Chemical Engineering and Technology, Kompleks Pusat Pengajian Jejawi 2, Universiti Malaysia Perlis (UniMAP), Arau 02600, Malaysia.
Mohd Mustafa Al Bakri AbdullahFaculty of Chemical Engineering and Technology, Kompleks Pusat Pengajian Jejawi 2, Universiti Malaysia Perlis (UniMAP), Arau 02600, Malaysia.
Aiman Bin Mohd HalilFaculty of Mechanical and Automotive Engineering Technology, Universiti Malaysia Pahang, Pekan 26600, Malaysia.
Amira Qistina Syamimi ZaifuddinFaculty of Mechanical and Automotive Engineering Technology, Universiti Malaysia Pahang, Pekan 26600, Malaysia.
Mahadzir Ishak MuhammadFaculty of Mechanical and Automotive Engineering Technology, Universiti Malaysia Pahang, Pekan 26600, Malaysia.
Andrei Victor SanduDepartment of Technologies and Equipments for Materials Processing, Faculty of Materials Science and Engineering, Gheorghe Asachi Technical University of Iaşi, Blvd. Mangeron, No. 51, 700050 Iasi, Romania.ORCID 0000-0002-9292-749X
Mădălina Simona BaltatuDepartment of Technologies and Equipments for Materials Processing, Faculty of Materials Science and Engineering, Gheorghe Asachi Technical University of Iaşi, Blvd. Mangeron, No. 51, 700050 Iasi, Romania.ORCID 0000-0002-5278-8958
Petrica VizureanuDepartment of Technologies and Equipments for Materials Processing, Faculty of Materials Science and Engineering, Gheorghe Asachi Technical University of Iaşi, Blvd. Mangeron, No. 51, 700050 Iasi, Romania.ORCID 0000-0002-3593-9400

Funding

Fundamental Research Grant Scheme FRGS/1/2019/TK05/UNIMAP/03/3inovations grant of the TUIASI MedTech_ 8 /2022
6 · The paper itself

Abstract

This paper elucidates the influence of dimple-microtextured copper substrate on the performance of Sn-0.7Cu solder alloy. A dimple with a diameter of 50 µm was produced by varying the dimple depth using different laser scanning repetitions, while the dimple spacing was fixed for each sample at 100 µm. The dimple-microtextured copper substrate was joined with Sn-0.7Cu solder alloy using the reflow soldering process. The solder joints' wettability, microstructure, and growth of its intermetallic compound (IMC) layer were analysed to determine the influence of the dimple-microtextured copper substrate on the performance of the Sn-0.7Cu solder alloy. It was observed that increasing laser scan repetitions increased the dimples' depth, resulting in higher surface roughness. In terms of soldering performance, it was seen that the solder joints' average contact angle decreased with increasing dimple depth, while the average IMC thickness increased as the dimple depth increased. The copper element was more evenly distributed for the dimple-micro-textured copper substrate than its non-textured counterpart.

Indexed as

dimple microtextureintermetallic compoundlaser surface texturinglead-free solderwettability

Identifiers

PMID36614433
PMCPMC9820858

What OpenQuestion holds

Textmetadata
LicenceCC BY
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Registered trials

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Read under generation 80e0d062 · epoch 390. Bibliography from PubMed, PubMed Central and OpenAlex; grants from NIH RePORTER; trial links from ClinicalTrials.gov; estimates, votes and beliefs from the OpenQuestion graph.