ArticleMolecules (Basel, Switzerland)2022
Thermal, Mechanical and Dielectric Properties of Polyimide Composite Films by In-Situ Reduction of Fluorinated Graphene.
Article in Molecules (Basel, Switzerland), 2022. The graph could read no effect estimate from its abstract, so it casts no vote on the map. Cited by 5 papers.
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Who cites it
5 citing papers in PubMed.
- Significantly Enhanced Corona Resistance of Epoxy Composite by Incorporation with Functionalized Graphene Oxide.Materials (Basel, Switzerland) · 2024Article
- A coherent engineering assessment of ABS/biochar biocomposites in MEX 3D additive manufacturing.Heliyon · 2024Article
- Photocatalytic Degradation of Methylene Blue and Anticancer Response of InMolecules (Basel, Switzerland) · 2023Article
- In Situ Fabrication of High Dielectric Constant Composite Films with Good Mechanical and Thermal Properties by Controlled Reduction.Molecules (Basel, Switzerland) · 2023Article
- Design of Carbon Nanocomposites Based on Sodium Alginate/Chitosan Reinforced with Graphene Oxide and Carbon Nanotubes.Polymers · 2023Article
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Authors and funding
6 authors.
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Abstract
Materials with outstanding mechanical properties and excellent dielectric properties are increasingly favored in the microelectronics industry. The application of polyimide (PI) in the field of microelectronics is limited because of the fact that PI with excellent mechanical properties does not have special features in the dielectric properties. In this work, PI composite films with high dielectric properties and excellent mechanical properties are fabricated by in-situ reduction of fluorinated graphene (FG) in polyamide acid (PAA) composites. The dielectric permittivity of pure PI is 3.47 and the maximum energy storage density is 0.664 J/cm
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