Evidence map›Paper›PMID 36402811›Full record

ArticleScientific reports2022

A comparative study of interfacial thermal conductance between metal and semiconductor.

Kongping Wu, Leng Zhang, Danbei Wang, Fangzhen Li, Pengzhan Zhang, Liwen Sang, Meiyong Liao, Kun Tang, Jiandong Ye, Shulin Gu

Abstract read
In one paragraph

Article in Scientific reports, 2022. The graph could read no effect estimate from its abstract, so it casts no vote on the map. Cited by 1 paper.

0numbers the graph read from it
0cells of the map it votes in
1citing papers in PubMed
–field-weighted citation impact
1 · What the graph read from it

What it found

Each row is one number read from the abstract, on the scale the paper reported it, with its interval. Left of the dashed line favours the treatment, right favours the comparator. Under each row is the sentence it came from. New to these charts? A ten-minute tutorial.

The abstract states no effect estimate the extractor could read, or names no intervention and outcome on the map, so this paper lights no cell and moves no belief. It is still indexed, cited and linked below.

2 · The registry

The trial behind it

Trials whose registry record cites this paper, or whose number appears in the abstract. A trial that started after this paper was published is citing it as background, not reporting it.

Neither the registry nor the abstract names a trial number. If this is a trial report, that itself is worth knowing.

3 · Its place in the literature

Who cites it

1 citing paper in PubMed.

  1. Article
4 · The record

Corrections and comments

PubMed lists nothing against this paper. Absence here is not a guarantee, only a check that was made.

5 · Who and what money

Authors and funding

10 authors.

Kongping WuSchool of Electronics and Information Engineering, Jinling Institute of Technology, Nanjing, 211169, Jiangsu, China. kpwu@jit.edu.cn.
Leng ZhangSchool of Electronics and Information Engineering, Jinling Institute of Technology, Nanjing, 211169, Jiangsu, China.
Danbei WangSchool of Electronics and Information Engineering, Jinling Institute of Technology, Nanjing, 211169, Jiangsu, China.
Fangzhen LiSchool of Electronics and Information Engineering, Jinling Institute of Technology, Nanjing, 211169, Jiangsu, China.
Pengzhan ZhangSchool of Electronics and Information Engineering, Jinling Institute of Technology, Nanjing, 211169, Jiangsu, China.
Liwen SangResearch Center for Functional Materials, National Institute for Materials Science (NIMS), Tsukuba, Ibaraki, 305-0044, Japan.
Meiyong LiaoResearch Center for Functional Materials, National Institute for Materials Science (NIMS), Tsukuba, Ibaraki, 305-0044, Japan. Meiyong.Liao@nims.go.jp.
Kun TangSchool of Electronic Science and Engineering, Nanjing University, Nanjing, 210093, Jiangsu, China.
Jiandong YeSchool of Electronic Science and Engineering, Nanjing University, Nanjing, 210093, Jiangsu, China.
Shulin GuSchool of Electronic Science and Engineering, Nanjing University, Nanjing, 210093, Jiangsu, China.

Funding

No grant is acknowledged in the PubMed record.

6 · The paper itself

Abstract

To understand and control thermal conductance of interface between metal and semiconductor has now become a crucial task for the thermal design and management of nano-electronic and micro-electronic devices. The interfacial alignments and electronic characteristics of the interfaces between metal and semiconductor are studied using a first-principles calculation based on hybrid density functional theory. The thermal conductance of interfaces between metal and semiconductor were calculated and analyzed using diffuse mismatch model, acoustic mismatch model and nonequilibrium molecular dynamics methods. Especially, according to nonequilibrium molecular dynamics, the values of thermal conductance were obtained to be 32.55 MW m

Identifiers

PMID36402811
PMCPMC9675788

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Read under generation 80e0d062 · epoch 390. Bibliography from PubMed, PubMed Central and OpenAlex; grants from NIH RePORTER; trial links from ClinicalTrials.gov; estimates, votes and beliefs from the OpenQuestion graph.