ReviewNanomaterials (Basel, Switzerland)2022
Recent Advances in Thermal Interface Materials for Thermal Management of High-Power Electronics.
Review in Nanomaterials (Basel, Switzerland), 2022. The graph could read no effect estimate from its abstract, so it casts no vote on the map. Cited by 18 papers.
What it found
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The abstract states no effect estimate the extractor could read, or names no intervention and outcome on the map, so this paper lights no cell and moves no belief. It is still indexed, cited and linked below.
The trial behind it
Trials whose registry record cites this paper, or whose number appears in the abstract. A trial that started after this paper was published is citing it as background, not reporting it.
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Who cites it
18 citing papers in PubMed.
- Article
- Synergetic properties of advanced materials for high-power and high-temperature applications.Discover nano · 2026Review
- Efficient foam-based thermal interface material functionalized with MWCNTs for CPU cooling applications: thermal performance modeling and Experimental studies.Scientific reports · 2026Article
- Reduced Anisotropic in Thermal Conductivity of Polymer Composites via Chemically Bonded BN-SiC Hybrid Fillers.Polymers · 2025Article
- Chain and End Group Effects of Self-Assembled Monolayers of Tripodal Molecules on Solid-Liquid Interfacial Thermal Resistance.Langmuir : the ACS journal of surfaces and colloids · 2025Article
- Oriented Boron Nitride in Calcium Alginate Matrix: A Sustainable Pathway to High-Efficiency Thermal Interface Materials.Materials (Basel, Switzerland) · 2025Article
- Constructing binder-free 3D thermal networks with hexagonal boron nitride of varying sizes to enhance polydimethylsiloxane composites: a comparative study.RSC advances · 2025Article
- Silicone Composites with Electrically Oriented Boron Nitride Platelets and Carbon Microfibers for Thermal Management of Electronics.Polymers · 2025Article
- Shaping Thermal Transport and Temperature Distribution via Anisotropic Carbon Fiber Reinforced Composites.ACS omega · 2024Article
- Long-Term Corrosion of Eutectic Gallium, Indium, and Tin (EGaInSn) Interfacing with Diamond.Materials (Basel, Switzerland) · 2024Article
- High-Performance Nanoscale Metallic Multilayer Composites: Techniques, Mechanical Properties and Applications.Materials (Basel, Switzerland) · 2024Review
- Playing with Low Amounts of Expanded Graphite for Melt-Processed Polyamide and Copolyester Nanocomposites to Achieve Control of Mechanical, Tribological, Thermal and Dielectric Properties.Nanomaterials (Basel, Switzerland) · 2024Article
- Enhancing the Thermal Conductivity of CNT/AlN/Silicone Rubber Composites by Using CNTs Directly Grown on AlN to Achieve a Reduced Filler Filling Ratio.Nanomaterials (Basel, Switzerland) · 2024Article
- Structural Designs of Transparent Polyimide Films with Low Dielectric Properties and Low Water Absorption: A Review.Nanomaterials (Basel, Switzerland) · 2023Review
- Effect of Hydrogen Annealing on Performances of BN-Based RRAM.Nanomaterials (Basel, Switzerland) · 2023Article
- Visualization of deformation-induced changes in carbon nanotube networks in rubber composites using lock-in thermography.RSC advances · 2023Article
- Effect of Graphite Nanoplatelet Size and Dispersion on the Thermal and Mechanical Properties of Epoxy-Based Nanocomposites.Nanomaterials (Basel, Switzerland) · 2023Article
- Heat Transfer in Nanostructured Materials.Nanomaterials (Basel, Switzerland) · 2023Article
Corrections and comments
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Authors and funding
4 authors.
Funding
Abstract
With the increased level of integration and miniaturization of modern electronics, high-power density electronics require efficient heat dissipation per unit area. To improve the heat dissipation capability of high-power electronic systems, advanced thermal interface materials (TIMs) with high thermal conductivity and low interfacial thermal resistance are urgently needed in the structural design of advanced electronics. Metal-, carbon- and polymer-based TIMs can reach high thermal conductivity and are promising for heat dissipation in high-power electronics. This review article introduces the heat dissipation models, classification, performances and fabrication methods of advanced TIMs, and provides a summary of the recent research status and developing trends of micro- and nanoscale TIMs used for heat dissipation in high-power electronics.
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Registered trials
Read under generation 80e0d062 · epoch 390. Bibliography from PubMed, PubMed Central and OpenAlex; grants from NIH RePORTER; trial links from ClinicalTrials.gov; estimates, votes and beliefs from the OpenQuestion graph.