ReviewNano-micro letters2022
Vertically Integrated Electronics: New Opportunities from Emerging Materials and Devices.
Review in Nano-micro letters, 2022. The graph could read no effect estimate from its abstract, so it casts no vote on the map. Cited by 11 papers.
What it found
Each row is one number read from the abstract, on the scale the paper reported it, with its interval. Left of the dashed line favours the treatment, right favours the comparator. Under each row is the sentence it came from. New to these charts? A ten-minute tutorial.
The abstract states no effect estimate the extractor could read, or names no intervention and outcome on the map, so this paper lights no cell and moves no belief. It is still indexed, cited and linked below.
The trial behind it
Trials whose registry record cites this paper, or whose number appears in the abstract. A trial that started after this paper was published is citing it as background, not reporting it.
Neither the registry nor the abstract names a trial number. If this is a trial report, that itself is worth knowing.
Who cites it
11 citing papers in PubMed.
- Dual-Modulated Vertically Stacked Transistors With Fully Laminated Plate-Type Architecture Featuring Nanoscale Channel Length.Advanced science (Weinheim, Baden-Wurttemberg, Germany) · 2026Article
- Full-Photolithographic High-Density Skin-Like Transistor Arrays for All-Organic Active-Matrix Displays.Nano-micro letters · 2026Article
- Nanoimprint Lithography Enabling High-Performance Organic Optoelectronics: Advances and Perspectives.Nano-micro letters · 2026Review
- Exploration of Quasi-Direct Band Edge in a Multilayer Ferroelectric Semiconductor for Applications in Van Der Waals Stacked Heterojunction Solar Cell and Photocatalytic Devices.Advanced science (Weinheim, Baden-Wurttemberg, Germany) · 2026Article
- Smart Dust for Chemical Mapping.Advanced materials (Deerfield Beach, Fla.) · 2025Review
- Responsive Molecules for Organic Neuromorphic Devices: Harnessing Memory Diversification.Advanced materials (Deerfield Beach, Fla.) · 2025Review
- Polymer Dielectric-Based Emerging Devices: Advancements in Memory, Field-Effect Transistor, and Nanogenerator Technologies.Micromachines · 2024Review
- Active Micro-Nano-Collaborative Bioelectronic Device for Advanced Electrophysiological Recording.Nano-micro letters · 2024Review
- An ultra-deep TSV technique enabled by the dual catalysis-based electroless plating of combined barrier and seed layers.Microsystems & nanoengineering · 2024Article
- Article
- Combination of Polymer Gate Dielectric and Two-Dimensional Semiconductor for Emerging Field-Effect Transistors.Polymers · 2023Review
Corrections and comments
PubMed lists nothing against this paper. Absence here is not a guarantee, only a check that was made.
Authors and funding
4 authors.
Funding
No grant is acknowledged in the PubMed record.
Abstract
Vertical three-dimensional (3D) integration is a highly attractive strategy to integrate a large number of transistor devices per unit area. This approach has emerged to accommodate the higher demand of data processing capability and to circumvent the scaling limitation. A huge number of research efforts have been attempted to demonstrate vertically stacked electronics in the last two decades. In this review, we revisit materials and devices for the vertically integrated electronics with an emphasis on the emerging semiconductor materials that can be processable by bottom-up fabrication methods, which are suitable for future flexible and wearable electronics. The vertically stacked integrated circuits are reviewed based on the semiconductor materials: organic semiconductors, carbon nanotubes, metal oxide semiconductors, and atomically thin two-dimensional materials including transition metal dichalcogenides. The features, device performance, and fabrication methods for 3D integration of the transistor based on each semiconductor are discussed. Moreover, we highlight recent advances that can be important milestones in the vertically integrated electronics including advanced integrated circuits, sensors, and display systems. There are remaining challenges to overcome; however, we believe that the vertical 3D integration based on emerging semiconductor materials and devices can be a promising strategy for future electronics.
Indexed as
Identifiers
What OpenQuestion holds
Registered trials
Read under generation 80e0d062 · epoch 390. Bibliography from PubMed, PubMed Central and OpenAlex; grants from NIH RePORTER; trial links from ClinicalTrials.gov; estimates, votes and beliefs from the OpenQuestion graph.