ArticleMicromachines2022
A Novel Manifold Dual-Microchannel Flow Field Structure with High-Performance Heat Dissipation.
Article in Micromachines, 2022. The graph could read no effect estimate from its abstract, so it casts no vote on the map. Cited by 2 papers.
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Who cites it
2 citing papers in PubMed.
- Design and Fabrication of Embedded Microchannel Cooling Solutions for High-Power-Density Semiconductor Devices.Micromachines · 2025Article
- A Novel Swept-Back Fishnet-Embedded Microchannel Topology.Micromachines · 2023Article
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Authors and funding
10 authors.
Funding
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Abstract
With the development of miniaturization and integration of electronic devices, the conventional manifold microchannels (MMCs) structure has been unable to meet the heat dissipation requirements caused by the rapid growth of internal heat flux. There is an urgent need to design a new heat dissipation structure with higher heat dissipation capacity to ensure the working stability and life of electronic devices. In this paper, we designed a novel manifold dual-microchannel (MDMC) cooling system that embedded the microchannel structure into the manifold microchannel structure. The MDMC not only has good heat dissipation performance that can meet the development needs of electronic equipment to miniaturization and integration, but also has a compact structure that does not increase the overall thickness and volume compared with MMC. The high temperature uniformity and heat transfer performance of MDMC are significantly improved compared to MMC. The
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