ArticleMicromachines2022
Thermoelectric Energy Micro Harvesters with Temperature Sensors Manufactured Utilizing the CMOS-MEMS Technique.
Article in Micromachines, 2022. The graph could read no effect estimate from its abstract, so it casts no vote on the map. Cited by 5 papers.
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Who cites it
5 citing papers in PubMed.
- A Low-Loss Hybrid Acoustic Bandpass Filter with Continuously Tunable Fractional Bandwidth.Micromachines · 2026Article
- Equivalent Circuit Extraction of SAW Resonator with Spurious Modes Interference over a -55 °C to 85 °C Temperature Range.Micromachines · 2026Article
- CMOS-Compatible Micro Photovoltaic Generator with Post-Processing Enhanced Optical Absorption.Micromachines · 2025Article
- The Effect of Area Density of Polysilicon Thermocouples on Thermoelectric Performance.Sensors (Basel, Switzerland) · 2025Article
- Numerical and Experimental Analysis of a Prototypical Thermoelectric Generator Dedicated to Wood-Fired Heating Stove.Micromachines · 2023Article
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Authors and funding
5 authors.
Funding
Abstract
This study develops a TEMH (thermoelectric energy micro harvester) chip utilizing a commercial 0.18 μm CMOS (complementary metal oxide semiconductor) process. The chip contains a TEMH and temperature sensors. The TEMH is established using a series of 54 thermocouples. The use of the temperature sensors monitors the temperature of the thermocouples. One temperature sensor is set near the cold part of the thermocouples, and the other is set near the hot part of the thermocouples. The performance of the TEMH relies on the TD (temperature difference) at the CHP (cold and hot parts) of the thermocouples. The more the TD at the CHP of the thermocouples increases, the higher the output voltage and output power of the TEMH become. To obtain a higher TD, the cold part of the thermocouples is designed as a suspended structure and is combined with cooling sheets to increase heat dissipation. The cooling sheet is constructed of a stack of aluminum layers and is mounted above the cold part of the thermocouple. A finite element method software, ANSYS, is utilized to compute the temperature distribution of the TEMH. The TEMH requires a post-process to obtain the suspended thermocouple structure. The post-process utilizes an RIE (reactive ion etch) to etch the two sacrificial materials, which are silicon dioxide and silicon substrate. The results reveal that the structure of the thermocouples is completely suspended and does not show any injury. The measured results reveal that the output voltage of the TEMH is 32.5 mV when the TD between the CHP of the thermocouples is 4 K. The TEMH has a voltage factor of 8.93 mV/mm
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