ArticleMaterials (Basel, Switzerland)2022
Modeling and Analysis of Micro-Grinding Processes with the Use of Grinding Wheels with a Conical and Hyperboloid Active Surface.
Article in Materials (Basel, Switzerland), 2022. The graph could read no effect estimate from its abstract, so it casts no vote on the map. Cited by 6 papers.
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Who cites it
6 citing papers in PubMed.
- Evaluation of the Surface Topography of Microfinishing Abrasive Films in Relation to Their Machining Capability of Nimonic 80A Superalloy.Materials (Basel, Switzerland) · 2024Article
- Effects of Pressure Rollers with Variable Compliance in the Microfinishing Process Utilizing Abrasive Films.Materials (Basel, Switzerland) · 2024Article
- Superfinishing with Abrasive Films Featuring Discontinuous Surfaces.Materials (Basel, Switzerland) · 2024Article
- Analysis of the Process and Results of High-Pressure Abrasive Water Jet Multilayer Cutting of Electrical Steel.Materials (Basel, Switzerland) · 2023Article
- Metrological Aspects of Assessing Surface Topography and Machining Accuracy in Diagnostics of Grinding Processes.Materials (Basel, Switzerland) · 2023Article
- Technological Aspects of Variation in Process Characteristics and Tool Condition in Grinding Process Diagnostics.Materials (Basel, Switzerland) · 2023Article
Corrections and comments
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Authors and funding
5 authors.
Funding
Abstract
In this article, a method of grinding small ceramic elements using hyperboloid and conical grinding wheels was presented. The method allowed for machining with a lower material removal speed and extending the grinding zone without reducing the efficiency of the process. In order to assess the process output parameters, numerical simulations were carried out for single-pass machining. This strategy allows for automation of the process. Grinding with a low material removal speed is recommended for the machining of small and thin elements, since this can avoid fracturing the elements. The methodology for selecting process parameters as well as the results of the abrasive grains activity analyses were presented. The analyses also concerned the roughness of machined surfaces and the variability of their textures. This grinding method was applied in the production of small ceramic elements that are used in the construction of electronic systems, and in the processing of small piezoceramic parts. This grinding technique could also be used in other grinding processes, where the removal of small machining allowances with high efficiency is required.
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