ArticlePolymers2022
Highly Thermally Conductive Epoxy Composites with AlN/BN Hybrid Filler as Underfill Encapsulation Material for Electronic Packaging.
Article in Polymers, 2022. The graph could read no effect estimate from its abstract, so it casts no vote on the map. Cited by 8 papers.
What it found
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Who cites it
8 citing papers in PubMed.
- Thermal Management and Reliability Engineering of Advanced HBM Packages: Materials, Interfaces, and Integrated Design Strategies.Micromachines · 2026Review
- Fabrication of Polyimide/Aluminum Nitride Composites and Wafer Channel Filling via Direct Ink Writing.Nanomaterials (Basel, Switzerland) · 2026Article
- Thermal conductivity modeling beyond the dilute limit using a body-centered cubic framework for densely packed polymer composites.Nature communications · 2025Article
- Review
- Article
- Advances in Multifunctional Polymer-Based Nanocomposites.Polymers · 2024Article
- Study on the performance of thin-film VCSELs on composite metal substrate.Frontiers of optoelectronics · 2023Article
- Development and Perspectives of Thermal Conductive Polymer Composites.Nanomaterials (Basel, Switzerland) · 2022Review
Corrections and comments
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Authors and funding
7 authors.
Funding
No grant is acknowledged in the PubMed record.
Abstract
In this study, the effects of a hybrid filler composed of zero-dimensional spherical AlN particles and two-dimensional BN flakes on the thermal conductivity of epoxy resin were studied. The thermal conductivity (TC) of the pristine epoxy matrix (EP) was 0.22 W/(m K), while the composite showed the TC of 10.18 W/(m K) at the 75 wt% AlN-BN hybrid filler loading, which is approximately a 46-fold increase. Moreover, various essential application properties were examined, such as the viscosity, cooling rate, coefficient of thermal expansion (CTE), morphology, and electrical properties. In particular, the AlN-BN/EP composite showed higher thermal stability and lower CTE (22.56 ppm/°C) than pure epoxy. Overall, the demonstrated outstanding thermal performance is appropriate for the production of electronic packaging materials, including next-generation flip-chip underfills.
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Registered trials
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