ReviewMaterials (Basel, Switzerland)2022
Effect of Sn Grain Orientation on Reliability Issues of Sn-Rich Solder Joints.
Review in Materials (Basel, Switzerland), 2022. The graph could read no effect estimate from its abstract, so it casts no vote on the map. Cited by 2 papers.
What it found
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The abstract states no effect estimate the extractor could read, or names no intervention and outcome on the map, so this paper lights no cell and moves no belief. It is still indexed, cited and linked below.
The trial behind it
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Who cites it
2 citing papers in PubMed, 22 citations in OpenAlex.
- The role of microstructure in the thermal fatigue of solder joints.Nature communications · 2024Article
- Electrical Performance Analysis of High-Speed Interconnection and Power Delivery Network (PDN) in Low-Loss Glass Substrate-Based Interposers.Micromachines · 2023Article
Corrections and comments
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Authors and funding
2 authors at 2 institutions in 2 countries.
Funding
Abstract
Sn-rich solder joints in three-dimensional integrated circuits and their reliability issues, such as the electromigration (EM), thermomigration (TM), and thermomechanical fatigue (TMF), have drawn attention related to their use in electronic packaging. The Sn grain orientation is recognized as playing an important role in reliability issues due to its anisotropic diffusivity, mechanical properties, and coefficient of thermal expansion. This study reviews the effects of the Sn grain orientation on the EM, TM, and TMF in Sn-rich solder joints. The findings indicate that in spite of the failure modes dominated by the Sn grain orientation, the size and shape of the solder joint, as well as the Sn microstructures, such as the cycling twining boundary (CTB), single crystals, and misorientations of the Sn grain boundary, should be considered in more detail. In addition, we show that two methods, involving a strong magnetic field and seed crystal layers, can control the Sn grain orientations during the solidification of Sn-rich solder joints.
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Registered trials
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