Evidence map›Paper›PMID 35699776›Full record

ReviewNano-micro letters2022

Emerging Flexible Thermally Conductive Films: Mechanism, Fabrication, Application.

Chang-Ping Feng, Fang Wei, Kai-Yin Sun, Yan Wang, Hong-Bo Lan, Hong-Jing Shang, Fa-Zhu Ding, Lu Bai, Jie Yang, Wei Yang

Abstract readReview
In one paragraph

Review in Nano-micro letters, 2022. The graph could read no effect estimate from its abstract, so it casts no vote on the map. Cited by 18 papers.

0numbers the graph read from it
0cells of the map it votes in
18citing papers in PubMed
–field-weighted citation impact
1 · What the graph read from it

What it found

Each row is one number read from the abstract, on the scale the paper reported it, with its interval. Left of the dashed line favours the treatment, right favours the comparator. Under each row is the sentence it came from. New to these charts? A ten-minute tutorial.

The abstract states no effect estimate the extractor could read, or names no intervention and outcome on the map, so this paper lights no cell and moves no belief. It is still indexed, cited and linked below.

2 · The registry

The trial behind it

Trials whose registry record cites this paper, or whose number appears in the abstract. A trial that started after this paper was published is citing it as background, not reporting it.

Neither the registry nor the abstract names a trial number. If this is a trial report, that itself is worth knowing.

3 · Its place in the literature

Who cites it

18 citing papers in PubMed.

  1. Cellulosic Composites in Lithium Metal Batteries.Advanced materials (Deerfield Beach, Fla.) · 2026
    Review
  2. Article
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  6. Achieving Ultra-High Heat Flux Transfer in Graphene Films via Tunable Gas Escape Channels.Advanced science (Weinheim, Baden-Wurttemberg, Germany) · 2025
    Article
  7. Article
  8. Article
  9. Article
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  12. Review
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4 · The record

Corrections and comments

PubMed lists nothing against this paper. Absence here is not a guarantee, only a check that was made.

5 · Who and what money

Authors and funding

10 authors.

Chang-Ping FengShandong Engineering Research Center for Additive Manufacturing, Qingdao University of Technology, Qingdao, 266520, People's Republic of China. fengc_p@163.com.
Fang WeiState Key Laboratory of Polymer Materials Engineering, College of Polymer Science and Engineering, Sichuan University, Chengdu, 610065, People's Republic of China.
Kai-Yin SunShandong Engineering Research Center for Additive Manufacturing, Qingdao University of Technology, Qingdao, 266520, People's Republic of China.
Yan WangShandong Engineering Research Center for Additive Manufacturing, Qingdao University of Technology, Qingdao, 266520, People's Republic of China.
Hong-Bo LanShandong Engineering Research Center for Additive Manufacturing, Qingdao University of Technology, Qingdao, 266520, People's Republic of China. hblan99@126.com.
Hong-Jing ShangInstitute of Electrical Engineering, Chinese Academy of Sciences, Beijing, 100190, People's Republic of China.
Fa-Zhu DingInstitute of Electrical Engineering, Chinese Academy of Sciences, Beijing, 100190, People's Republic of China.
Lu BaiState Key Laboratory of Polymer Materials Engineering, College of Polymer Science and Engineering, Sichuan University, Chengdu, 610065, People's Republic of China.
Jie YangState Key Laboratory of Polymer Materials Engineering, College of Polymer Science and Engineering, Sichuan University, Chengdu, 610065, People's Republic of China.
Wei YangState Key Laboratory of Polymer Materials Engineering, College of Polymer Science and Engineering, Sichuan University, Chengdu, 610065, People's Republic of China. weiyang@scu.edu.cn.

Funding

No grant is acknowledged in the PubMed record.

6 · The paper itself

Abstract

Effective thermal management is quite urgent for electronics owing to their ever-growing integration degree, operation frequency and power density, and the main strategy of thermal management is to remove excess energy from electronics to outside by thermal conductive materials. Compared to the conventional thermal management materials, flexible thermally conductive films with high in-plane thermal conductivity, as emerging candidates, have aroused greater interest in the last decade, which show great potential in thermal management applications of next-generation devices. However, a comprehensive review of flexible thermally conductive films is rarely reported. Thus, we review recent advances of both intrinsic polymer films and polymer-based composite films with ultrahigh in-plane thermal conductivity, with deep understandings of heat transfer mechanism, processing methods to enhance thermal conductivity, optimization strategies to reduce interface thermal resistance and their potential applications. Lastly, challenges and opportunities for the future development of flexible thermally conductive films are also discussed.

Indexed as

Flexible thermally conductive filmsHeat transfer mechanismInterface thermal resistanceThermal conductivityThermal management applications

Identifiers

PMID35699776
PMCPMC9198190

What OpenQuestion holds

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LicenceCC BY
Read underepoch 390

Registered trials

None linked

Read under generation 80e0d062 · epoch 390. Bibliography from PubMed, PubMed Central and OpenAlex; grants from NIH RePORTER; trial links from ClinicalTrials.gov; estimates, votes and beliefs from the OpenQuestion graph.