ArticleACS omega2022
Superhydrophobic Electrodeposited Copper Surface for Robust Condensation Heat Transfer.
Article in ACS omega, 2022. The graph could read no effect estimate from its abstract, so it casts no vote on the map. Cited by 2 papers.
What it found
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The abstract states no effect estimate the extractor could read, or names no intervention and outcome on the map, so this paper lights no cell and moves no belief. It is still indexed, cited and linked below.
The trial behind it
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Who cites it
2 citing papers in PubMed.
- Effect of electrodeposition time on physical characteristics and antibacterial activity of copper-incorporated TiORSC advances · 2025Article
- Engineering copper and copper-based materials for a post-antibiotic era.Frontiers in bioengineering and biotechnology · 2025Review
Corrections and comments
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Authors and funding
6 authors.
Funding
No grant is acknowledged in the PubMed record.
Abstract
Superhydrophobic surfaces have great potential for various applications owing to their superior dewetting and mobility of water droplets. However, the physical robustness of nano/microscale rough surface structures supporting superhydrophobicity is critical in real applications. In this study, to create a superhydrophobic surface on copper, we employed copper electrodeposition to create a nano/microscale rough surface structure as an alternative to the nanoneedle CuO structure. The rough electrodeposited copper surface with a thin Teflon coating shows superhydrophobicity. The enhancement of dewetting and mobility of water droplets on copper surfaces by electrodeposition and hydrophobization significantly improved the condensation heat transfer by up to approximately 78% compared to that of copper substrates. Moreover, the nano/microscale rough surface structure of the electrodeposited copper surface exhibits better tolerance to physical rubbing, which destroys the nanoneedle-structured CuO surface. Therefore, the condensation heat transfer of the superhydrophobic electrodeposited copper surface decreased by only less than 10%, while that of the nanoneedle-structured CuO surface decreased by approximately 40%. This suggests that an electrodeposited copper surface can lead to the stable performance of superhydrophobicity for real applications.
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Registered trials
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