ArticleACS applied nano materials2022
Functionalized Gold Nanoparticles with a Cohesion Enhancer for Robust Flexible Electrodes.
Article in ACS applied nano materials, 2022. The graph could read no effect estimate from its abstract, so it casts no vote on the map. Cited by 10 papers.
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Who cites it
10 citing papers in PubMed, 38 citations in OpenAlex.
- High-Concentration Gold Nanoparticle Pastes for Advanced Deposition-Based Sensor Manufacturing.Sensors (Basel, Switzerland) · 2026Article
- Predictive design of stretchable electrodes with strain-insensitive performance via robotics- and machine learning-integrated workflow.Nature communications · 2026Article
- Next-generation health monitoring: The role of nanomaterials in 3D-printed wearable devices.Materials today (Kidlington, England) · 2025Article
- On-Demand Sintering of Gold Nanoparticles via Controlled Removal of o-Nitrobenzyl Thiol Ligands Under Record-Low Power for Conductive Patterns.Advanced science (Weinheim, Baden-Wurttemberg, Germany) · 2025Article
- Recent Advances in 3D Printed Electrodes - Bridging the Nano to Mesoscale.Advanced science (Weinheim, Baden-Wurttemberg, Germany) · 2025Review
- Laser-Induced Silver Nanowires/Polymer Composites for Flexible Electronics and Electromagnetic Compatibility Application.Polymers · 2024Article
- Introductory Review of Soft Implantable Bioelectronics Using Conductive and Functional Hydrogels and Hydrogel Nanocomposites.Gels (Basel, Switzerland) · 2024Review
- Evaluation of Transducer Elements Based on Different Material Configurations for Aptamer-Based Electrochemical Biosensors.Biosensors · 2024Article
- Ligand Decomposition Differences during Thermal Sintering of Oleylamine-Capped Gold Nanoparticles in Ambient and Inert Environments: Implications for Conductive Inks.ACS applied nano materials · 2023Article
- A Fluorinated Polyimide Based Nano Silver Paste with High Thermal Resistance and Outstanding Thixotropic Performance.Polymers · 2023Article
Corrections and comments
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Authors and funding
11 authors at 1 institution in 1 country.
Funding
No grant is acknowledged in the PubMed record.
Abstract
The development of conductive inks is required to enable additive manufacturing of electronic components and devices. A gold nanoparticle (AuNP) ink is of particular interest due to its high electrical conductivity, chemical stability, and biocompatibility. However, a printed AuNP film suffers from thermally induced microcracks and pores that lead to the poor integrity of a printed electronic component and electrical failure under external mechanical deformation, hence limiting its application for flexible electronics. Here, we employ a multifunctional thiol as a cohesion enhancer in the AuNP ink to prevent the formation of microcracks and pores by mediating the cohesion of AuNPs via strong interaction between the thiol groups and the gold surface. The inkjet-printed AuNP electrode exhibits an electrical conductivity of 3.0 × 10
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Registered trials
Read under generation 80e0d062 · epoch 390. Bibliography from PubMed, PubMed Central and OpenAlex; grants from NIH RePORTER; trial links from ClinicalTrials.gov; estimates, votes and beliefs from the OpenQuestion graph.