ArticleJournal of micromechanics and microengineering : structures, devices, and systems2021
Bonding methods for chip integration with Parylene devices.
Article in Journal of micromechanics and microengineering : structures, devices, and systems, 2021. The graph could read no effect estimate from its abstract, so it casts no vote on the map. Cited by 8 papers.
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Who cites it
8 citing papers in PubMed.
- Towards maximizing optical access through Smart Dura.Journal of neural engineering · 2026Article
- Exploiting Device Deformability for Fluid and Particle Manipulation.Small (Weinheim an der Bergstrasse, Germany) · 2026Review
- Systematic evaluation of surgical insertion of flexible neural probe arrays into deeper brain targets using length modulation methods.Journal of neural engineering · 2026Article
- A Comprehensive Research Dissemination Model for Polymer-Based Neural Interfaces.IEEE transactions on bio-medical engineering · 2026Article
- Innovating beyond electrophysiology through multimodal neural interfaces.Nature reviews electrical engineering · 2025Article
- A high-density 1,024-channel probe for brain-wide recordings in non-human primates.Nature neuroscience · 2024Article
- A CMOS-based highly scalable flexible neural electrode interface.Science advances · 2023Article
- Cleanroom strategies for micro- and nano-fabricating flexible implantable neural electronics.Philosophical transactions. Series A, Mathematical, physical, and engineering sciences · 2022Article
Corrections and comments
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Authors and funding
2 authors.
Funding
Abstract
Flexible electronics require more compact interconnects for next-generation devices. Polymer devices can be bonded to integrated circuit chips, but combining flexible and rigid substrates poses unique technical challenges. Existing technologies either cannot achieve the density required for modern chips or employ specialized equipment and complex processes to do so. Here, we adapt several approaches to achieve fine-pitch bonding between rigid and flexible substrates including epoxy, ultrasonic wire, and anisotropic conductive film bonding and also introduce a novel technique called polymer ultrasonic on bump (PUB) bonding. Using Parylene C devices and various rigid substrates as our model testbed systems, we investigate these four methods across a range of bond pad size and pitch by measuring yield and resistance and by subjecting devices to thermomechanical reliability tests. We demonstrate that all methods are capable of bonding fine pitch interconnects (100
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Registered trials
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