ArticleRSC advances2021
Fabrication and simulation of a layered ultrahigh thermal conductive material made of self-assembled graphene and polydopamine on a copper substrate.
Article in RSC advances, 2021. The graph could read no effect estimate from its abstract, so it casts no vote on the map. Cited by 6 papers.
What it found
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The abstract states no effect estimate the extractor could read, or names no intervention and outcome on the map, so this paper lights no cell and moves no belief. It is still indexed, cited and linked below.
The trial behind it
Trials whose registry record cites this paper, or whose number appears in the abstract. A trial that started after this paper was published is citing it as background, not reporting it.
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Who cites it
6 citing papers in PubMed, 8 citations in OpenAlex.
- TiOACS applied materials & interfaces · 2024Article
- DNA aptamer-functionalized PDA nanoparticles: from colloidal chemistry to biosensor applications.Frontiers in bioengineering and biotechnology · 2024Article
- Elucidating the modified performance of high nuclearity of Cu nanostructures-PTFE thin film.Scientific reports · 2023Article
- Polydopamine Nanoparticles Functionalized Electrochemical DNA Aptasensor for Serum Glycated Albumin Detection.International journal of molecular sciences · 2022Article
- Article
- The effects of process parameters on polydopamine coatings employed in tissue engineering applications.Frontiers in bioengineering and biotechnology · 2022Review
Corrections and comments
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Authors and funding
8 authors at 2 institutions in 1 country.
Funding
No grant is acknowledged in the PubMed record.
Abstract
A composite material of graphene (G) and polydopamine (PDA) on a copper (Cu) substrate (G/PDA@Cu) was fabricated successfully by sequential immersion deposition in a dopamine solution and an aqueous graphene oxide suspension before annealing. Optimum preparation conditions were explored by the orthogonal experimental method. The morphology and chemical composition of G/PDA@Cu were studied systematically by a series of characterization techniques. The thermal-conductive performance was evaluated by a laser flash thermal analyser. The thermal conductivity of G/PDA@Cu was 519.43 W m
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Registered trials
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