Evidence map›Paper›PMID 35383178›Full record

ArticleNature communications2022

Non-invasive digital etching of van der Waals semiconductors.

Jian Zhou, Chunchen Zhang, Li Shi, Xiaoqing Chen, Tae Soo Kim, Minseung Gyeon, Jian Chen, Jinlan Wang, Linwei Yu, Xinran Wang and 9 more

Abstract read
PubMed Full text at PMC Publisher
In one paragraph

Article in Nature communications, 2022. The graph could read no effect estimate from its abstract, so it casts no vote on the map. Cited by 2 papers.

0numbers the graph read from it
0cells of the map it votes in
2citing papers in PubMed
–field-weighted citation impact
1 · What the graph read from it

What it found

Each row is one number read from the abstract, on the scale the paper reported it, with its interval. Left of the dashed line favours the treatment, right favours the comparator. Under each row is the sentence it came from. New to these charts? A ten-minute tutorial.

The abstract states no effect estimate the extractor could read, or names no intervention and outcome on the map, so this paper lights no cell and moves no belief. It is still indexed, cited and linked below.

2 · The registry

The trial behind it

Trials whose registry record cites this paper, or whose number appears in the abstract. A trial that started after this paper was published is citing it as background, not reporting it.

Neither the registry nor the abstract names a trial number. If this is a trial report, that itself is worth knowing.

3 · Its place in the literature

Who cites it

2 citing papers in PubMed.

  1. Review
  2. Article
4 · The record

Corrections and comments

PubMed lists nothing against this paper. Absence here is not a guarantee, only a check that was made.

5 · Who and what money

Authors and funding

19 authors.

Jian Zhou *National Laboratory of Solid-State Microstructures and Collaborative Innovation Center of Advanced Microstructures, Nanjing University, Nanjing, China.
Chunchen Zhang *National Laboratory of Solid-State Microstructures and Collaborative Innovation Center of Advanced Microstructures, Nanjing University, Nanjing, China.
Li ShiDepartment of Physics, Southeast University, Nanjing, China.
Xiaoqing ChenNational Laboratory of Solid-State Microstructures and Collaborative Innovation Center of Advanced Microstructures, Nanjing University, Nanjing, China.
Tae Soo KimDepartment of Materials Science and Engineering, Korea Advanced Institute of Science and Technology, Daejeon, Republic of Korea.
Minseung GyeonDepartment of Materials Science and Engineering, Korea Advanced Institute of Science and Technology, Daejeon, Republic of Korea.
Jian ChenNational Laboratory of Solid-State Microstructures and Collaborative Innovation Center of Advanced Microstructures, Nanjing University, Nanjing, China.ORCID http://orcid.org/0000-0002-1360-8969
Jinlan WangDepartment of Physics, Southeast University, Nanjing, China.ORCID http://orcid.org/0000-0002-4529-874X
Linwei YuNational Laboratory of Solid-State Microstructures and Collaborative Innovation Center of Advanced Microstructures, Nanjing University, Nanjing, China.ORCID http://orcid.org/0000-0002-0801-5210
Xinran WangNational Laboratory of Solid-State Microstructures and Collaborative Innovation Center of Advanced Microstructures, Nanjing University, Nanjing, China.ORCID http://orcid.org/0000-0002-3975-1667
Kibum KangDepartment of Materials Science and Engineering, Korea Advanced Institute of Science and Technology, Daejeon, Republic of Korea.ORCID http://orcid.org/0000-0003-1674-1826
Emanuele OrgiuInstitut national de la recherche scientifique, Centre Énergie Matériaux Télécommunications, 1650 Blvd. Lionel-Boulet, J3X 1S2, Varennes, QC, Canada.ORCID http://orcid.org/0000-0002-8232-0950
Paolo SamorìUniversity of Strasbourg, CNRS, ISIS UMR 7006, 8 allée Gaspard Monge, F-67000, Strasbourg, France. samori@unistra.fr.ORCID http://orcid.org/0000-0001-6256-8281
Kenji WatanabeWPI-MANA, National Institute for Materials Science, Tsukuba, 305-0044, Ibaraki, Japan.ORCID http://orcid.org/0000-0003-3701-8119
Takashi TaniguchiWPI-MANA, National Institute for Materials Science, Tsukuba, 305-0044, Ibaraki, Japan.ORCID http://orcid.org/0000-0002-1467-3105
Kazuhito TsukagoshiWPI-MANA, National Institute for Materials Science, Tsukuba, 305-0044, Ibaraki, Japan.ORCID http://orcid.org/0000-0001-9710-2692
Peng WangNational Laboratory of Solid-State Microstructures and Collaborative Innovation Center of Advanced Microstructures, Nanjing University, Nanjing, China. wangpeng@nju.edu.cn.ORCID http://orcid.org/0000-0003-0788-6687
Yi ShiNational Laboratory of Solid-State Microstructures and Collaborative Innovation Center of Advanced Microstructures, Nanjing University, Nanjing, China. yshi@nju.edu.cn.ORCID http://orcid.org/0000-0002-1082-0315
Songlin LiNational Laboratory of Solid-State Microstructures and Collaborative Innovation Center of Advanced Microstructures, Nanjing University, Nanjing, China. sli@nju.edu.cn.ORCID http://orcid.org/0000-0002-3995-9580

Funding

No grant is acknowledged in the PubMed record.

6 · The paper itself

Abstract

The capability to finely tailor material thickness with simultaneous atomic precision and non-invasivity would be useful for constructing quantum platforms and post-Moore microelectronics. However, it remains challenging to attain synchronized controls over tailoring selectivity and precision. Here we report a protocol that allows for non-invasive and atomically digital etching of van der Waals transition-metal dichalcogenides through selective alloying via low-temperature thermal diffusion and subsequent wet etching. The mechanism of selective alloying between sacrifice metal atoms and defective or pristine dichalcogenides is analyzed with high-resolution scanning transmission electron microscopy. Also, the non-invasive nature and atomic level precision of our etching technique are corroborated by consistent spectral, crystallographic, and electrical characterization measurements. The low-temperature charge mobility of as-etched MoS

Identifiers

PMID35383178
PMCPMC8983769

What OpenQuestion holds

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Registered trials

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Read under generation 80e0d062 · epoch 390. Bibliography from PubMed, PubMed Central and OpenAlex; grants from NIH RePORTER; trial links from ClinicalTrials.gov; estimates, votes and beliefs from the OpenQuestion graph.