ArticleNanomaterials (Basel, Switzerland)2022
The Investigation of the Effect of Filler Sizes in 3D-BN Skeletons on Thermal Conductivity of Epoxy-Based Composites.
Article in Nanomaterials (Basel, Switzerland), 2022. The graph could read no effect estimate from its abstract, so it casts no vote on the map. Cited by 9 papers.
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Who cites it
9 citing papers in PubMed.
- Effect of Micro and Nano Boron Nitride on Thermal Conductivity and Electrical Properties of Mica Tape.Materials (Basel, Switzerland) · 2026Article
- Enhancing the dielectric characteristics and DC flashover of epoxy resin composites by surface modification of AgNbOScientific reports · 2025Article
- Polymeric Nanocomposites of Boron Nitride Nanosheets for Enhanced Directional or Isotropic Thermal Transport Performance.Nanomaterials (Basel, Switzerland) · 2024Review
- Review
- Enhanced Thermal Conductivity and Dielectric Properties of Epoxy Composites with Fluorinated Graphene Nanofillers.Nanomaterials (Basel, Switzerland) · 2023Article
- Improved Photoluminescence Performance of EuMolecules (Basel, Switzerland) · 2023Article
- Fragment-Resistant Property Optimization within Ballistic Inserts Obtained on the Basis of Para-Aramid Materials.Materials (Basel, Switzerland) · 2022Article
- Investigation on the Controllable Synthesis of Colorized and Magnetic Polystyrene Beads With Millimeter SizeFrontiers in chemistry · 2022Article
- Study of Relaxations in Epoxy/Rubber Composites by Thermally Stimulated Depolarization Current and Dielectric Spectroscopy.Frontiers in chemistry · 2022Article
Corrections and comments
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Authors and funding
6 authors.
Funding
Abstract
Thermally conductive and electrically insulating materials have attracted much attention due to their applications in the field of microelectronics, but through-plane thermal conductivity of materials is still low at present. In this paper, a simple and environmentally friendly strategy is proposed to improve the through-plane thermal conductivity of epoxy composites using a 3D boron nitride (3D-BN) framework. In addition, the effect of filler sizes in 3D-BN skeletons on thermal conductivity was investigated. The epoxy composite with larger BN in lateral size showed a higher through-plane thermal conductivity of 2.01 W/m·K and maintained a low dielectric constant of 3.7 and a dielectric loss of 0.006 at 50 Hz, making it desirable for the application in microelectronic devices.
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