ArticleMicromachines2021
Femtosecond-Laser-Ablation Dynamics in Silicon Revealed by Transient Reflectivity Change.
Article in Micromachines, 2021. The graph could read no effect estimate from its abstract, so it casts no vote on the map. Cited by 5 papers.
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Who cites it
5 citing papers in PubMed.
- Multi-Scale Modeling and Experimental Validation of Thermo-Mechanical Responses in Femtosecond Laser Micromachining of Copper.Materials (Basel, Switzerland) · 2026Article
- Sub-50-femtosecond gain-managed amplified pulses enhance nonlinear ablation efficiency.Biomedical optics express · 2026Article
- Pulsed Laser-Bleaching Semiconductor and Photodetector.Sensors (Basel, Switzerland) · 2024Article
- High-Efficiency Copper Removal by Nitrogen Plasma-Assisted Picosecond Laser Processing.Micromachines · 2022Article
- Integration of Multifocal Microlens Array on Silicon Microcantilever via Femtosecond-Laser-Assisted Etching Technology.Micromachines · 2022Article
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Authors and funding
4 authors.
Funding
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Abstract
The dynamics of ablation in monocrystalline silicon, from electron-hole plasma generation to material expansion, upon irradiation by a single femtosecond laser pulse (1030 nm, 300 fs pulse duration) at a wide range of fluences is investigated using a time-resolved microscopy technique. The reflectivity evolution obtained from dynamic images in combination with a theoretical Drude model and a Two-Temperature model provides new insights on material excitation and ablation process. For all fluences, the reflectivity increased to a temporary stable state after hundreds of femtoseconds. This behavior was predicted using a temperature-dependent refractive index in the Drude model. The increase in velocity of plasma generation with increasing fluence was theoretically predicted by the Two-Temperature model. Two ablation regimes at high fluences (>0.86 J/cm
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