Evidence map›Paper›PMID 35038249›Full record

ReviewAdvanced science (Weinheim, Baden-Wurttemberg, Germany)2022

High-Resolution 3D Printing for Electronics.

Young-Geun Park, Insik Yun, Won Gi Chung, Wonjung Park, Dong Ha Lee, Jang-Ung Park

Abstract readReview
In one paragraph

Review in Advanced science (Weinheim, Baden-Wurttemberg, Germany), 2022. The graph could read no effect estimate from its abstract, so it casts no vote on the map. Cited by 50 papers.

0numbers the graph read from it
0cells of the map it votes in
50citing papers in PubMed
–field-weighted citation impact
1 · What the graph read from it

What it found

Each row is one number read from the abstract, on the scale the paper reported it, with its interval. Left of the dashed line favours the treatment, right favours the comparator. Under each row is the sentence it came from. New to these charts? A ten-minute tutorial.

The abstract states no effect estimate the extractor could read, or names no intervention and outcome on the map, so this paper lights no cell and moves no belief. It is still indexed, cited and linked below.

2 · The registry

The trial behind it

Trials whose registry record cites this paper, or whose number appears in the abstract. A trial that started after this paper was published is citing it as background, not reporting it.

Neither the registry nor the abstract names a trial number. If this is a trial report, that itself is worth knowing.

3 · Its place in the literature

Who cites it

50 citing papers in PubMed.

  1. Metastable Polymers for Circular 3D Printing.Advanced materials (Deerfield Beach, Fla.) · 2026
    Article
  2. Smart Bioinks for 4D Bioprinting: Requirements, Design, and Applications.Advanced science (Weinheim, Baden-Wurttemberg, Germany) · 2026
    Review
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4 · The record

Corrections and comments

PubMed lists nothing against this paper. Absence here is not a guarantee, only a check that was made.

5 · Who and what money

Authors and funding

6 authors.

Young-Geun ParkDepartment of Materials Science and Engineering, Yonsei University, Seoul, 03722, Republic of Korea.ORCID https://orcid.org/0000-0003-1579-0220
Insik YunDepartment of Materials Science and Engineering, Yonsei University, Seoul, 03722, Republic of Korea.
Won Gi ChungDepartment of Materials Science and Engineering, Yonsei University, Seoul, 03722, Republic of Korea.
Wonjung ParkDepartment of Materials Science and Engineering, Yonsei University, Seoul, 03722, Republic of Korea.
Dong Ha LeeDepartment of Materials Science and Engineering, Yonsei University, Seoul, 03722, Republic of Korea.
Jang-Ung ParkDepartment of Materials Science and Engineering, Yonsei University, Seoul, 03722, Republic of Korea.ORCID https://orcid.org/0000-0003-1522-4958

Funding

Bio and Medical Technology Development Program 2018M3A9F1021649Institute for Basic Science IBS-R026-D1Korea Evaluation Institute of Industrial Technology 20010366Korea Evaluation Institute of Industrial Technology 20013621Korea Initiative for fostering University of Research and Innovation 2020M3H1A1077207Ministry of Trade, Industry and Energy 2021M3D1A204991411Ministry of Trade, Industry and Energy 2021M3H4A1A01079416National Research Foundation of Korea 2021R1C1C2008657Samsung SRFC-TC2003-03
6 · The paper itself

Abstract

The ability to form arbitrary 3D structures provides the next level of complexity and a greater degree of freedom in the design of electronic devices. Since recent progress in electronics has expanded their applicability in various fields in which structural conformability and dynamic configuration are required, high-resolution 3D printing technologies can offer significant potential for freeform electronics. Here, the recent progress in novel 3D printing methods for freeform electronics is reviewed, with providing a comprehensive study on 3D-printable functional materials and processes for various device components. The latest advances in 3D-printed electronics are also reviewed to explain representative device components, including interconnects, batteries, antennas, and sensors. Furthermore, the key challenges and prospects for next-generation printed electronics are considered, and the future directions are explored based on research that has emerged recently.

Indexed as

3D printingsfreeform electronicsintegrated circuitsprinted electronicswireless sensors

Identifiers

PMID35038249
PMCPMC8922115

What OpenQuestion holds

Textmetadata
LicenceCC BY
Read underepoch 390

Registered trials

None linked

Read under generation 80e0d062 · epoch 390. Bibliography from PubMed, PubMed Central and OpenAlex; grants from NIH RePORTER; trial links from ClinicalTrials.gov; estimates, votes and beliefs from the OpenQuestion graph.